A new procedure for measuring the decohesion energy for thin ductile films on substrates

Bagchi, Arunabha; Lucas, G.E.; Suo, Zhigang; Evans, A.G.

doi:10.1557/jmr.1994.1734

Cited by 184 publications

(59 citation statements)

References 23 publications

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“…These include pull-off and peel tests(tape tests [21]), scratch testing [22][23][24][25], four point bend tests [26,27], stressed overlayers [28][29][30] , indentation tests [24,[31][32][33], laser spallation tests [34,35], double cantilever beam tests [36,37] and microcantilever deflection etc. We will start with brief review of the most common techniques before going into more detail about the indentation and scratch tests which are often the only available tests for thin hard coatings.…”

Section: Techniques To Assess Interfacial Toughnessmentioning

confidence: 99%

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Approaches to investigate delamination and interfacial toughness in coated systems: an overview

Chen¹,

Bull²

2010

J. Phys. D: Appl. Phys.

121

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The fundamental property which often dictates the performance of a coating is its adhesion to the substrate and thus there are many techniques to measure adhesion. The choice of methods is dependent on many factors such as the mechanical properties of the coating and substrate, the interface properties, the microstructure of the coating/substrate system, residual stress, coating thickness and the intended application. Most tests aim to introduce a stable interfacial crack and make it propagate under controlled conditions and model this process to determine adhesion. The corresponding models are either stress analysis-based or energy-based. With the advent of miniature systems and very thin functional coatings, there is a need for characterization of adhesion at small length scales and some specific tests have been developed which are not appropriate for thicker coatings. Among these, indentation and scratch methods have the widest range of applicability but it is necessary to analyse the failure mechanisms before choosing an appropriate model to extract adhesion parameters. This paper reviews the main quantitative adhesion tests for coatings and highlights the tests which can be used to assess submicrometre coatings and thin films. The paper also highlights the modelling and analysis methods necessary to extract reliable adhesion properties illustrating this with examples for submicrometre coatings on silicon and architectural glass.

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Section: Techniques To Assess Interfacial Toughnessmentioning

confidence: 99%

“…This requires depositing a thick superlayer on the top of the film of interest so that it increases the apparent film thickness and the total residual stress in the combined coating without altering the tested interface ( [2], [28]). This makes it easier to debond the interface.…”

Section: Stressed Overlayer Testmentioning

confidence: 99%

Approaches to investigate delamination and interfacial toughness in coated systems: an overview

Chen¹,

Bull²

2010

J. Phys. D: Appl. Phys.

121

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“…: THIN COPPER FILMS ON SILICA SUBSTRATES Polycrystalline copper films have been vapor deposited or diffusion bonded to silica substrates at thicknesses ranging from less than 0.1 pm to almost 100 pm and tested to determine conditions for delamination (Bagchi et al 1994; Bagchi and Evans, 1996). The films are at yield at the test temperature (20.…”

Section: An Applicationmentioning

confidence: 99%

Nonlinear delamination mechanics for thin films

Wei

Hutchinson

1997

Journal of the Mechanics and Physics of Solids

144

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Delaminationof prestressed thin films on thick substrates is analysed accounting for plastic dissipation in either the substrate or film. Emphasis is on large scale yielding wherein the height of the plastic zone at the propagating interface crack tip is comparable to the film thickness. Such conditions are common for both metal and polymer thin films on elastic substrates or for ceramic coatings on metal substrates when the interface between the film and substrate is reasonably strong. Under large scale yielding, the notion of a thickness-independent interface toughness no longer pertains, and a nonlinear fracture mechanics is required to quantify delamination.Two such approaches are pursued in this paper using models based on the attainment of critical conditions at the interface crack tip within the plastic zone. Steady-state film delamination is analysed for conditions where yielding occurs either in the film or in the substrate, and critical combinations of prestress and thickness are predicted. The theory is applied to a recent set of experiments on copper films delaminating from silica substrates. r{Tj 1997

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“…It does not explain how cracks are able to propagate quasi-statically when atomic separation is the fracture mechanism. Recent experiments on metalceramic interfaces (Elssner et al, 1994;Bagchi et al, 1994;Bagchi and Evans, 1996) have provided detailed evidence of quasi-static propagation of interface decohesion cracks in the presence of substantial plasticity in the metal. Another approach, pursued most recently by Suo et al (1993) and Beltz, et al (1996), employs a model which excludes plasticity within some distance D from the crack tip.…”

Section: Introductionmentioning

confidence: 99%

Steady-state crack growth and work of fracture for solids characterized by strain gradient plasticity

Wei

Hutchinson

1997

Journal of the Mechanics and Physics of Solids

262

205

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Mode I steady-state crack growth is analysed under plane strain conditions in small scale yielding. The elastic-plastic solid is characterized by a generalization of JZ flow theory which accounts for the influence of the gradients of plastic strains on hardening. The constitutive model involves one new parameter, a material length 1, specifying the scale of nonuniform deformation at which hardening elevation owing to strain gradients becomes important. Gradients of plastic strain at a sharp crack tip result in a substantial increase in tractions ahead of the tip. This has important consequences for crack growth in materials that fail by decohesion or cleavage at the atomic scale. The new constitutive law is used in conjunction with a model which represents the fracture process by an embedded traction-separation relation applied on the plane ahead of the crack tip. The ratio of the macroscopic work of fracture to the work of the fracture process is calculated as a function of the parameters characterizing the fracture process and the solid, with particular emphasis on the role of 1. 0 1997 Elsevier Science Ltd

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A new procedure for measuring the decohesion energy for thin ductile films on substrates

Cited by 184 publications

References 23 publications

Approaches to investigate delamination and interfacial toughness in coated systems: an overview

Approaches to investigate delamination and interfacial toughness in coated systems: an overview

Nonlinear delamination mechanics for thin films

Steady-state crack growth and work of fracture for solids characterized by strain gradient plasticity

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