To keep pace with the demands in optical communications, electro-optic modulators should feature large bandwidths, operate across all telecommunication windows, offer a small footprint, and allow for CMOS-compatible fabrication to keep costs low(1). Here, we demonstrate a new ultra-compact plasmonic phase modulator based on the Pockels effect in a nonlinear polymer. The device has a length of only 29 mu m and operates at 40 Gbit s(-1). Its modulation frequency response is flat up to 65 GHz and beyond. The modulator has been tested to work across a 120-nm-wide wavelength range centred at 1,550 nm, and is expected to work beyond this range. Its operation has been verified for temperatures up to 85 degrees C and it is easy to fabricate. To the best of our knowledge, this is the most compact high-speed phase modulator demonstrated to date

Optical modulators encode electrical signals to the optical domain and thus constitute a key element in high-capacity communication links 1,2 . Ideally, they should feature operation at the highest speed with the least power consumption on the smallest footprint, and at low cost 3 . Unfortunately, current technologies fall short of these criteria 4 . Recently, plasmonics has emerged as a solution offering compact and fast devices 5-7 . Yet, practical implementations have turned out to be rather elusive.Here, we introduce a 70 GHz all-plasmonic Mach-Zehnder modulator that fits into a silicon waveguide of 10 μm length. This dramatic reduction in size by more than two orders of magnitude compared with photonic Mach-Zehnder modulators results in a low energy consumption of 25 fJ per bit up to the highest speeds. The technology suggests a cheap co-integration with electronics.Mach-Zehnder modulators (MZMs) are the most versatile electro-optical converters in high-end communication systems. MZMs are unique, as they can be used to encode multiple bits within one symbol with the highest quality. They are thus instrumental in increasing the capacity of modern communication links 1 . Until now, MZMs have mostly been based on the lithium niobate material system, which requires footprints on the order of cm 2 . Recently, more compact silicon-based modulators have emerged. These devices have already shown operation at bandwidths up to 55 GHz (ref. 8), they are cost-effective, and they feature lengths on the order of hundreds of micrometres to millimetres 2,3,8-12 . Yet, complementary metal-oxide semiconductor electronics (CMOS) house hundreds of transistors on a single μm 2 , making a co-integration of today's silicon MZMs with CMOS electronics impractical 4 . In pursuit of more compact silicon modulators, various approaches have been demonstrated, such as resonant silicon ring modulators 13,14 or germanium-based electro-absorption modulators 15,16 . However, encoding advanced modulation formats is challenging 17 , and high-capacity transmission has, so far, only been achieved with MZMs 2,12 . Instead, plasmonics has drawn significant interest as an alternative solution 6,7 . In plasmonics, optical signals are converted to surface plasmon polaritons (SPPs) propagating at metal-dielectric interfaces, where they can be confined below the diffraction limit of optics 18 . This means that plasmonic devices require only a few µm 2 of footprint 19,20 . With such reduced dimensions, the technology is much closer to bridging the size gap with respect to CMOS electronics. Furthermore, there are various theoretical studies indicating that plasmonic MZMs should offer hundreds of gigahertz of bandwidth 5,21 . To date, however, there is very little experimental evidence to support this claim. Recently, a plasmonic phase modulator demonstrated operation at 40 Gbit s −1 (ref. 22). One could now envision integrating such plasmonic phase modulators into a silicon waveguide MZM configuration. However, by combining plasmonics and silicon photoni...

An electrically controlled ultra-compact surface plasmon polariton absorption modulator (SPPAM) is proposed. The device can be as small as a few micrometers depending on the required extinction ratio and the acceptable loss. The device allows for operation far beyond 100 Gbit / s, being only limited by RC time constants. The absorption modulator comprises a stack of metal / insulator / metal-oxide / metal layers, which support a strongly confined asymmetric surface plasmon polariton (SPP) in the 1.55 μm telecommunication wavelength window. Absorption modulation is achieved by electrically modulating the free carrier density in the intermediate metal-oxide layer. The concept is supported by proof-of-principle experiments.

Silicon photonics offers tremendous potential for inexpensive high-yield photonic-electronic integration. Besides conventional dielectric waveguides, plasmonic structures can also be efficiently realized on the silicon photonic platform, reducing device footprint by more than an order of magnitude. However, neither silicon nor metals exhibit appreciable second-order optical nonlinearities, thereby making efficient electro-optic modulators challenging to realize. These deficiencies can be overcome by the concepts of silicon-organic hybrid (SOH) and plasmonicorganic hybrid (POH) integration, which combine silicon-oninsulator (SOI) waveguides and plasmonic nanostructures with organic electro-optic cladding materials.

Abstract-We demonstrate single laser 32.5 Tbit/s 16QAM Nyquist WDM transmission over a total length of 227 km of SMF-28 without optical dispersion compensation. A number of 325 optical carriers are derived from a single laser and encoded with dualpolarization 16QAM data using sinc-shaped Nyquist pulses. As we use no guard bands, the carriers have a spacing of 12.5 GHz equal to the symbol rate or Nyquist bandwidth of the data. We achieve a net spectral efficiency of 6.4 bit/s/Hz using a softwaredefined transmitter, which generates the electric drive-signals for the electro-optic modulator in realtime.

Silicon-plasmonics enables the fabrication of active photonic circuits in CMOS technology with unprecedented operation speed and integration density. Regarding applications in chip-level optical interconnects, fast and efficient plasmonic photodetectors with ultrasmall footprints are of special interest. A particularly promising approach to silicon-plasmonic photodetection is based on internal photoemission (IPE), which exploits intrinsic absorption in plasmonic waveguides at the metal-dielectric interface. However, while IPE plasmonic photodetectors have already been demonstrated, their performance is still far below that of conventional high-speed photodiodes. In this paper, we demonstrate a novel class of IPE devices with performance parameters comparable to those of state-of-the-art photodiodes while maintaining footprints below 1 μm 2 . The structures are based on asymmetric metal-semiconductormetal waveguides with a width of less than 75 nm. We measure record-high sensitivities of up to 0.12 A/W at a wavelength of 1550 nm. The detectors exhibit opto-electronic bandwidths of at least 40 GHz. We demonstrate reception of on-off keying data at rates of 40 Gbit/s.

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