Novel aluminum-copper compound castings devoid of oxide layers at the interface between the joining partners were developed in order to increase the thermal conductivity of the hybrid component. Due to the natural oxide layers of both aluminum and copper, metallurgical bonds between such bi-metal castings cannot be easily achieved in conventional processes. However, in an atmosphere comparable to extreme high vacuum created by using silane-doped inert gas, metallurgical bonds between the active surfaces of both aluminum and copper can be realized without additional coatings or fluxes. An intermetallic was created between aluminum and copper. Thus, very high thermal conductivities could be obtained for these hybrid castings, exceeding those of conventionally joined samples considerably. The intermetallic phase seams emerging between the joining partners were investigated using scanning electron microscopy and X-ray diffraction. The reduction of casting temperatures resulted in narrower intermetallic phase seams and these in turn in a much lower contact resistance between the two joining partners. This effect can be utilized for increasing the heat transfer capabilities of compound casting components employed for cooling heat sources such as high-power light-emitting diodes.

Compound cast heat sinks have various advantages over conventionally manufactured ones, but oxides present on the metals and formation of a brittle intermetallic layer (IMC) make casting difficult. In the present study, a novel approach was used that employs a silane-doped argon environment to overcome these issues. Oxidation could be fully suppressed and thermal heat conductivities around 67 W/(m·K) were obtained for the compound zone. The microstructural analysis revealed that the thickness of the IMC layer could be kept below the critical value of 3 µm. Yet, the process window was found to be extremely tight. The modelling revealed that the critical time period for formation of the IMC layer is only on the order of a few 10 s.

In this study, the thermal conductivity (κ) of Al-Cu eutectics was investigated by experimental and computational methods to shed light on the role of these compounds in thermal properties of Al-Cu connections in compound casting. Specifically, the nonequilibrium molecular dynamics (MD) method was utilized to simulate the lattice thermal conductivity (κl) of six compositions of Al-Cu with 5-30 at. % Cu. To extend the results of the MD simulations to bulk materials, instead of using conventional linear extrapolation methods, a machine learning approach was developed for the dataset acquired from the MD simulations. The bootstrapping approach was utilized to find the most suitable method among the support vector machine (SVM) with polynomial and radial basis function (RBF) kernels and the random forest method. The results showed that the SVM model with RBF kernel performed the best, and thus was used to predict the bulk κl. Subsequently, the chosen compositions were produced by induction casting and their electrical conductivities were measured via eddy current method for calculating the electronic contribution of κ using the Wiedemann–Franz law. Finally, the actual κ of the alloys were measured using the xenon flash method and the results were compared with the computational values. It is shown that the MD method is capable of successfully simulating the thermal conductivity of this system. In addition, the experimental results demonstrate that the κ of Al-Cu eutectics decreases almost linearly with formation of the Al2Cu phase due to increase in the Cu content. Overall, the current findings can be used to enhance the κ of cooling devices made via Al-Cu compound casting.

A metallurgical joint between aluminum and copper established by compound casting provides for high thermal conductivity, which is required for lightweight cooling solutions in applications such as high-power light-emitting diodes or computer processors. If casting is employed in a silane-doped inert gas atmosphere whose oxygen partial pressure is adequate to extreme high vacuum, reoxidation of the active surfaces of aluminum and copper is prevented, and thus a metallurgical bond can be created directly between aluminum and copper. With this approach, thermal conductivities as high as 88.3 W/m·K were realized. In addition, X-ray microscopy was used to shed light on the microstructure–thermal property relationship. It is demonstrated that both porosity and non-bonded areas have a substantial impact on the thermophysical properties of the compound zone. Based on the data obtained, casting parameters can be developed that provide for defect-free bonding zones and optimal heat transfer between the joining partners.

Grinding tools can be manufactured from metal, vitrified, and resin bond materials. In combination with superabrasives like diamond grains, metal-bonded tools are used in a wide range of applications. The main advantages of metal over vitrified and resin bonds are high grain retention forces and high thermal conductivity. This paper investigates the influence of the atmosphere and manufacturing parameters such as sintering temperature on the properties of titanium-bonded grinding layers. Titanium is an active bond material, which can increase the retention of diamond grains in metal-bonded grinding layers. This can lead to higher bond stress and, consequently, decreased wear of grinding tools in use when compared to other commonly used bond materials like bronze. The reason for this is the adhesive bond between titanium and diamond due to the formation of carbides in the interface, whereas bronze can only form a mechanical cohesion with diamond grains. However, when using oxygen-affine metals such as titanium, oxidizing effects could limit the strength of the bond due to insufficient adhesion between Ti-powder particles and the prevention of carbide formation. The purpose of this paper is to show the influence of the sintering atmosphere and temperature on the properties of titanium-bonded diamond grinding layers using the mechanical and thermal characterization of specimens. A higher vacuum (Δpatm = − 75 mbar) reduces the oxidation of titanium particles during sintering, which leads to higher critical bond stress (+ 38% @ Ts = 900 °C) and higher thermal conductivity (+ 3.4% @Ts = 1000 °C, Ta = 25 °C). X-ray diffraction measurements could show the formation of carbides in the cross-section of specimens, which also has a positive effect on the critical bond stress due to an adhesive bond between titanium and diamond.