Abstract:A metallurgical joint between aluminum and copper established by compound casting provides for high thermal conductivity, which is required for lightweight cooling solutions in applications such as high-power light-emitting diodes or computer processors. If casting is employed in a silane-doped inert gas atmosphere whose oxygen partial pressure is adequate to extreme high vacuum, reoxidation of the active surfaces of aluminum and copper is prevented, and thus a metallurgical bond can be created directly betwee… Show more
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