Semiconductor quantum dots (QDs) have been demonstrated viable for efficient light emission applications, in particular for the emission of single photons on demand. However, the preparation of QDs emitting photons with predefined and deterministic polarization vectors has proven arduous. Access to linearly polarized photons is essential for various applications. In this report, a novel concept to directly generate linearly-polarized photons is presented. This concept is based on InGaN QDs grown on top of elongated GaN hexagonal pyramids, by which the predefined elongation determines the polarization vectors of the emitted photons from the QDs. This growth scheme should allow fabrication of ultracompact arrays of photon emitters, with a controlled polarization direction for each individual emitter. Keywords: GaN; InGaN; photoluminescence; polarized emission; quantum dot INTRODUCTION Quantum dots (QDs) have validated their important role in current optoelectronic devices and they are also seen promising as light sources for quantum information applications. An improved efficiency of laser diodes and light-emitting diodes can be achieved by the incorporation of QDs ensembles in the optically active layers.1 In addition, the proposed quantum computer applications rely on photons with distinct energy and polarization vectors, which can be seen as the ultimate demand on photons emitted from individual QDs.2 A common requirement raised for several optoelectronic applications, e.g., liquid-crystal displays, three-dimensional visualization, (bio)-dermatology 3 and the optical quantum computers, 4 is the need of linearly polarized light for their operation. For existing applications, the generation of linearly polarized light is obtained by passing unpolarized light through a combination of polarization selective filters and waveguides, with an inevitable efficiency loss as the result. These losses can be drastically reduced by employment of sources, which directly generate photons with desired polarization directions.Conventional QDs grown via the Stranski-Krastanov (SK) growth mode are typically randomly distributed over planar substrates and possess different degrees of anisotropies. The anisotropy in strain field and/or geometrical shape of each individual QD determines the polarization performance of the QD emission. Accordingly, a cumbersome post-selection of QDs with desired polarization properties among the randomly distributed QDs is required for device integration.

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Fabrication of single InGaN quantum dots (QDs) on top of GaN micropyramids is reported. The formation of single QDs is evidenced by showing single sub-millielectronvolt emission lines in microphotoluminescence (μPL) spectra. Tunable QD emission energy by varying the growth temperature of the InGaN layers is also demonstrated. From μPL, it is evident that the QDs are located in the apexes of the pyramids. The fact that the emission lines of the QDs are linear polarized in a preferred direction implies that the apexes induce unidirected anisotropic fields to the QDs. The single emission lines remain unchanged with increasing the excitation power and/or crystal temperature. An in-plane elongated QD forming a shallow potential with an equal number of trapped electrons and holes is proposed to explain the absence of other exciton complexes.

We demonstrated successful growth of AlN at a temperature of 1200 °C in a set of hot-wall MOCVD systems with the possibility of straightforward scaling up the process on larger wafer areas to meet the demand of device technologies. We outlined several aspects of the carefully optimized design and process parameters with relevance to achievement of a high overall growth rate (1 and up to 2 μm/h), efficiency, and uniformity, which to a great extent depends on how consumption of growth-limiting species by gas-phase adduct formation can actively be prevented. Mixing of the precursors upstream from the deposition area facilitates uniform epitaxial growth, while the greater uniformity of substrate temperature inherent to the hot-wall reactor and rotation of the wafer are of fundamental importance for layer-growth uniformity. The AlN layer thickness can be controlled with an accuracy of ±1.3% on 2 in. wafers. The low-temperature cathodoluminescence spectrum of the AlN epitaxial material is strongly dominated by the intense near band-gap deep UV emission at about 208 nm.

Currently, up to 50% of the channel temperature in AlGaN/GaN electronic devices is due to the thermal-boundary resistance (TBR) associated with the nucleation layer (NL) needed between GaN and SiC substrates for high-quality heteroepitaxy. Using 3-D time-resolved Raman thermography, it is shown that modifying the NL used for GaN on SiC epitaxy from the metalorganic chemical vapor deposition (MOCVD)-grown standard AlN-NL to a hot-wall MOCVD-grown AlN-NL reduces NL TBR by 25%, resulting in ∼10% reduction of the operating temperature of AlGaN/GaN HEMTs. Considering the exponential relationship between device lifetime and temperature, lower TBR NLs open new opportunities for improving the reliability of AlGaN/ GaN devices.