Recent advances in biomaterials, thin film processing, and nanofabrication offer the opportunity to design electronics with novel and unique capabilities, including high mechanical stability and biodegradation, which are relevant in medical implants, environmental sensors, and wearable and disposable devices. Combining reliable electrical performance with high mechanical deformation and chemical degradation remains still challenging. This work reports temperature sensors whose material composition enables full biodegradation while the layout and ultrathin format ensure a response time of 10 ms and stable operation demonstrated by a resistance variation of less than 0.7% when the devices are crumpled, folded, and stretched up to 10%. Magnesium microstructures are encapsulated by a compostable‐certified flexible polymer which exhibits small swelling rate and a Young's modulus of about 500 MPa which approximates that of muscles and cartilage. The extension of the design from a single sensor to an array and its integration onto a fluidic device, made of the same polymer, provides routes for a smart biodegradable system for flow mapping. Proper packaging of the sensors tunes the dissolution dynamics to a few days in water while the connection to a Bluetooth module demonstrates wireless operation with 200 mK resolution prospecting application in food tracking and in medical postsurgery monitoring.

Two-dimensional (2D) semiconducting transition metal dichalcogenides (TMDs) are good candidates for high-performance flexible electronics. However, most demonstrations of such flexible field-effect transistors (FETs) to date have been on the micron scale, not benefitting from the short-channel advantages of 2D-TMDs. Here, we demonstrate flexible monolayer MoS2 FETs with the shortest channels reported to date (down to 50 nm) and remarkably high on-current (up to 470 µA µm -1 at 1 V drain-to-source voltage) which is comparable to flexible graphene or crystalline silicon FETs. This is achieved using a new transfer method wherein contacts are initially patterned on the rigid TMD growth substrate with nanoscale lithography, then coated with a polyimide (PI) film which becomes the flexible substrate after release, with the contacts and TMD. We also apply this transfer process to other TMDs, reporting the first flexible FETs with MoSe2 and record on-current for flexible WSe2 FETs. These achievements push 2D semiconductors closer to a technology for low-power and high-performance flexible electronics.For several years, the "Internet-of-Things" (IoT) has been increasingly prevalent in the forecast of future electronics. From monitoring the environment and machines around us to the human body, IoT envisions electronics physically present in every aspect of our daily lives. While some devices may be realized on rigid silicon, there is a need for electronics with new non-planar form factors 1,2 , which are thin and light, and can be conformally attached to objects with unusual shapes, on the human skin, or even implanted into the human body 1 . With these applications in mind, we need to realize electronics on flexible substrates that are robust to mechanical strain, easy to integrate, and capable of low-power consumption and high performance at the nanoscale 2,3 .Recent studies have suggested that 2D materials are good candidates for flexible substrates, because of their lack of dangling bonds, good carrier mobility in atomically thin (sub-1 nm) layers, reduced

Semiconducting transition metal dichalcogenides (TMDs) are promising for flexible high-specific-power photovoltaics due to their ultrahigh optical absorption coefficients, desirable band gaps and self-passivated surfaces. However, challenges such as Fermi-level pinning at the metal contact–TMD interface and the inapplicability of traditional doping schemes have prevented most TMD solar cells from exceeding 2% power conversion efficiency (PCE). In addition, fabrication on flexible substrates tends to contaminate or damage TMD interfaces, further reducing performance. Here, we address these fundamental issues by employing: (1) transparent graphene contacts to mitigate Fermi-level pinning, (2) MoOx capping for doping, passivation and anti-reflection, and (3) a clean, non-damaging direct transfer method to realize devices on lightweight flexible polyimide substrates. These lead to record PCE of 5.1% and record specific power of 4.4 W g−1 for flexible TMD (WSe2) solar cells, the latter on par with prevailing thin-film solar technologies cadmium telluride, copper indium gallium selenide, amorphous silicon and III-Vs. We further project that TMD solar cells could achieve specific power up to 46 W g−1, creating unprecedented opportunities in a broad range of industries from aerospace to wearable and implantable electronics.

Flexing computer memory Phase change materials leverage changes in structure into differences in electrical resistance that are attractive for computer memory and processing applications. Khan et al . developed a flexible phase change memory device with layers of antimony telluride and germanium telluride deposited directly on a flexible polyimide substrate. The device shows multilevel operation with a low switching current density. The combination of phase change and mechanical properties is attractive for the large number of emerging applications for flexible electronics. —BG

Although recent progress in the field of flexible electronics has allowed the realization of biocompatible and conformable electronics, systematic approaches which combine high bendability (<3 mm bending radius), high stretchability (>3-4%), and low complexity in the fabrication process are still missing. Here, we show a technique to induce randomly oriented and customized wrinkles on the surface of a biocompatible elastomeric substrate, where Thin-Film Transistors (TFTs) and circuits (inverter and logic NAND gates) based on amorphous-IGZO are fabricated. By tuning the wavelength and the amplitude of the wrinkles, the devices are fully operational while bent to 13 μm bending radii as well as while stretched up to 5%, keeping unchanged electrical properties. Moreover, a flexible rectifier is also realized, showing no degradation in the performances while flat or wrapped on an artificial human wrist. As proof of concept, transparent TFTs are also fabricated, presenting comparable electrical performances to the nontransparent ones. The extension of the buckling approach from our TFTs to circuits demonstrates the scalability of the process, prospecting applications in wireless stretchable electronics to be worn or implanted.

Strain engineering is an important method for tuning the properties of semiconductors and has been used to improve the mobility of silicon transistors for several decades. Recently, theoretical studies have predicted that strain can also improve the mobility of two-dimensional (2D) semiconductors, e.g., by reducing intervalley scattering or lowering effective masses. Here, we experimentally show strain-enhanced electron mobility in monolayer MoS2 transistors with uniaxial tensile strain, on flexible substrates. The on-state current and mobility are nearly doubled with tensile strain up to 0.7%, and devices return to their initial state after release of the strain. We also show a gate-voltage-dependent gauge factor up to 200 for monolayer MoS2, which is higher than previous values reported for sub-1 nm thin piezoresistive films. These results demonstrate the importance of strain engineering 2D semiconductors for performance enhancements in integrated circuits, or for applications such as flexible strain sensors.

In the field of flexible electronics, emerging applications require biocompatible and unobtrusive devices, which can withstand different modes of mechanical deformation and achieve low complexity in the fabrication process. Here, the fabrication of a mesa-shaped elastomeric substrate, supporting thin-film transistors (TFTs) and logic circuits (inverters), is reported. High-relief structures are designed to minimize the strain experienced by the electronics, which are fabricated directly on the pillars' surface. In this design configuration, devices based on amorphous indium-gallium-zinc-oxide can withstand different modes of deformation. Bending, stretching, and twisting experiments up to 6 mm radius, 20% uniaxial strain, and 180° global twisting, respectively, are performed to show stable electrical performance of the TFTs. Similarly, a fully integrated digital inverter is tested while stretched up to 20% elongation. As a proof of the versatility of mesa-shaped geometry, a biocompatible and stretchable sensor for temperature mapping is also realized. Using pectin, which is a temperature-sensitive material present in plant cells, the response of the sensor shows current modulation from 13 to 28 °C and functionality up to 15% strain. These results demonstrate the performance of highly flexible electronics for a broad variety of applications, including smart skin and health monitoring.

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