A contactless transition from a high-permittivity microstrip line (r = 9.9) to an air-filled waveguide (WG) has been impedance-matched over a large simulated relative bandwidth of 38% (W-band, 75-110 GHz). The transition couples the EM fields directly from the MMIC's microstrip line via an SIW and an off-chip stub section to a ridge WG section. The novel structure is low loss and suits pick-and-place assembly techniques of mm-Wave MMICs inside metal WGs. The design process is detailed and manufacturing tolerances of the Alumina prototype PCB are discussed. The measured back-to-back structure retains an appreciable insertion loss smaller than 0.8 dB for a single transition and a fractional bandwidth of 28% (72-95 GHz) over which the return loss is greater than 10 dB.
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A contactless, broadband and low-loss microstripto-groove gap waveguide transition operating at W-band is presented. The principle of operation is based on transforming EM fields from the SIW to the ridge gap waveguide mode via electromagnetic coupling. This is advantageous, since the proposed solution avoids the use of metal contact between the SIW and one of the waveguide parts. Furthermore, metamaterial-based gap waveguide technology provides a resonance-free packaging solution.
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