Toward wide-band low-loss gap-waveguide-integrated grid amplifiers

Aljarosha, Alhassan; Smolders, A.B.; Ivashina, Marianna; Maaskant, Rob

doi:10.1109/isanp.2017.8228732

“…Gap waveguide with MMIC holder PCB inside. Based on [25] the minimization of the inductance, resistance and capacitance contributing to the input/output signals of the active circuits. The drawback of the flip-chip technology is heat dissipation because of the small contact between the chip and the heatsink.…”

Section: Interconnection Solutionsmentioning

confidence: 99%

“…At the same time, this type of waveguide can serve as a packaging solution. The work described in [25] shows how to integrate the MMIC inside of the gap waveguide as shown in Fig. 6.…”

Section: Interconnection Solutionsmentioning

confidence: 99%

Low-Noise Amplifier-Antenna Co-Design Overview

Alekseev

¹

,

Eriksson

²

,

Johansson

³

et al. 2022

2022 16th European Conference on Antennas and Propagation (EuCAP)

1

0

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published version features the final layout of the paper including the volume, issue and page numbers. Link to publication General rightsCopyright and moral rights for the publications made accessible in the public portal are retained by the authors and/or other copyright owners and it is a condition of accessing publications that users recognise and abide by the legal requirements associated with these rights.• Users may download and print one copy of any publication from the public portal for the purpose of private study or research. • You may not further distribute the material or use it for any profit-making activity or commercial gain • You may freely distribute the URL identifying the publication in the public portal.If the publication is distributed under the terms of Article 25fa of the Dutch Copyright Act, indicated by the "Taverne" license above, please follow below link for the End User

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“…On the other hand, in OFF-chip power combiners, as reported in [10], power generated from multiples ICs is combined spatially using a reflecting wall. It uses a high-Q metal-only combining structure offering a low-loss and wideband performance.…”

Section: Introductionmentioning

confidence: 99%

Silicon-Based IC-Waveguide Integration for Compact and High-Efficiency mm-Wave Spatial Power Combiners

Aljarosha

¹

,

Kaul

²

,

Smolders

³

et al. 2021

IEEE Trans. Compon., Packag. Manufact. Technol.

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published version features the final layout of the paper including the volume, issue and page numbers. Link to publication General rightsCopyright and moral rights for the publications made accessible in the public portal are retained by the authors and/or other copyright owners and it is a condition of accessing publications that users recognise and abide by the legal requirements associated with these rights.• Users may download and print one copy of any publication from the public portal for the purpose of private study or research. • You may not further distribute the material or use it for any profit-making activity or commercial gain • You may freely distribute the URL identifying the publication in the public portal.If the publication is distributed under the terms of Article 25fa of the Dutch Copyright Act, indicated by the "Taverne" license above, please follow below link for the End User

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“…Based on these waveguides a variety of components [11][12][13][14][15] have been created. In addition, the reduction of cross-talk effects allows for improving the performances of different components such as grid amplifiers [16]. Finally, gap waveguide technology has been proposed as an alternative solution for antenna array feeding networks [17,18].…”

Section: Introductionmentioning

confidence: 99%

A Gap Waveguide-Based Compact Rectangular Waveguide to a Packaged Microstrip Inline Transition

Pérez-Escudero

¹

,

Torres-García

²

,

Gonzalo

³

et al. 2020

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In this paper two different simple to design and easy to manufacturing transitions from a microstrip to rectangular waveguide based on ridge and groove gap waveguides are studied. The first one is based on a combination of a groove and ridge gap waveguide. In this case, the microstrip substrate occupies the whole bottom metallic housing block, namely, the transition and the gap between the bed of nails and the lid; therefore, it does not require any substrate shaping. Nevertheless, the transition needs to replace groove waveguide by ridge gap waveguide sections to avoid higher-order mode excitation. In the second approach, based on only a groove gap waveguide, the substrate is shaped to be only in the microstrip section, that is, outside the bed of nails area. This leads to a simplification of the design procedure. Prototypes of both transitions have been characterized, showing good agreement with the simulations taking into account the manufacturing tolerances. Performance comparable to the state-of-the-art in this frequency band has been achieved.

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Toward wide-band low-loss gap-waveguide-integrated grid amplifiers

Cited by 3 publications

References 4 publications

Low-Noise Amplifier-Antenna Co-Design Overview

Low-Noise Amplifier-Antenna Co-Design Overview

Silicon-Based IC-Waveguide Integration for Compact and High-Efficiency mm-Wave Spatial Power Combiners

A Gap Waveguide-Based Compact Rectangular Waveguide to a Packaged Microstrip Inline Transition

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