In this numerical study, seven distinct three-dimensional unique models of micro-channel heat sinks have been investigated. A solid-porous compound wavy channel with optimum thickness of porous fins has been newly adapted to improve the thermal and hydraulic performance of the forthcoming micro-electronic devices. The finite volume method is used to solve the hydraulic and thermal performance of micro-channel heat sinks, and Darcy–Forchheimer flow models are applied for fluid flow through porous fins. Water is employed as a working fluid. Solid wall and porous fins are made of copper material; during analysis, Reynolds numbers vary from 50 to 300, and the effective thermal conductivity has been considered for porous fins as well as solid-porous compound fins. The effect of solid fins, porous fins, and compound fins are comprehensively determined. The result shows that as the thickness of porous fins increases in compound wavy channel, the heat transfer performance significantly increases up to 63.6% and pressure drop penalty decreases up to 55.32% as compared to the regular straight channel (solid fins) heat sinks. This is due to reduction of viscous shear stress at the place of fluid-porous interface and slip effect of fluids in the porous zone. Hence, the ability of the solid-porous compound wavy micro-channel heat sinks can effectively enhance the cooling performance of high-power electronic devices.
Nowadays, microchannel‐based cooling systems are one of the best heat exchangers to extract a huge amount of heat from miniature devices. In this present study, a 15‐μm thickness porous fin in solid/porous compound wavy (CWPF) with a 45° secondary channel (SC) heat sink has been investigated with a Reynolds number range of 50–300 and is compared with CWPF heat sinks. Fluid flow through porous fins is solved by Darcy–Forchheimer flow models, and the thermo‐hydraulic performance of microchannel heat sinks is solved a using finite volume approach. The walls and fins are made of copper, and the operating fluid is pure water. The significant impact on heat transfer and fluid flow characteristics has been discussed. The effect of SC/route width variations is examined. It is observed that as the width ratio (α) increases, both the Nusselt number and pressure drop significantly increase up to the width ratio of 3 and then decrease as it increases. This is due to the increased effective fluid mixing by the dean vortices through secondary flow at the crest and trough as well as permeation effect in the porous zone. The highest performance factor of 68.95% is measured for CWPF (45° SC) with a width ratio of 3 when compared with CWPF heat sinks. Hence, CWPF with SC flow has an ability to improve the cooling rate of micro‐electronics components.
Microchannel-based heat sink is used to transfer huge amount of heat from electronics devices since last four decades, which is one of the best heat exchanger so far. In this study, a solid porous compound wavy microchannel heat sink (MCHS) with different angles of slanted passage has been evaluated with the help of commercial ANSYS fluent software at Reynolds number of 50 to 300 and compared with sinusoidal channel heat sink (SCHS). Fluid flow through porous fins is solved by Darcy–Forchheimer flow models and the thermo-hydraulic performance of MCHS is solved using finite volume approach. The walls and fins are made of copper, and the operating fluid is pure water. The impacts on secondary flow slanted passage with different angles (e.g. 30D, 45D, 60D, 75D, and 90D) in compound wavy channels are scrutinized. It is observed that as the slanted passage angle decreases in the compound wavy channel, heat transfer performance is significantly enhanced as well as pressure drop penalty decreases when compared to the SCHS. This is due to the increased effective fluid mixing by the dean vortices through secondary flow slanted passage at the crest and trough as well as permeation effect on the porous zone. The highest performance factor of 102.19% is calculated for solid/porous compound wavy microchannel heat sink (CWMC) 30D slanted passage heat sink at Reynolds number of 150. Hence, CWMC heat sink with secondary flow slanted passage have an ability to improve the cooling rate of microelectronics components.
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