Abstract:Microchannel-based heat sink is used to transfer huge amount of heat from electronics devices since last four decades, which is one of the best heat exchanger so far. In this study, a solid porous compound wavy microchannel heat sink (MCHS) with different angles of slanted passage has been evaluated with the help of commercial ANSYS fluent software at Reynolds number of 50 to 300 and compared with sinusoidal channel heat sink (SCHS). Fluid flow through porous fins is solved by Darcy–Forchheimer flow models and… Show more
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