Long DRAM latency is a critical performance bottleneck in current systems. DRAM access latency is defined by three fundamental operations that take place within the DRAM cell array: (i) activation of a memory row, which opens the row to perform accesses; (ii) precharge, which prepares the cell array for the next memory access; and (iii) restoration of the row, which restores the values of cells in the row that were destroyed due to activation. There is significant latency variation for each of these operations across the cells of a single DRAM chip due to irregularity in the manufacturing process. As a result, some cells are inherently faster to access, while others are inherently slower. Unfortunately, existing systems do not exploit this variation.The goal of this work is to (i) experimentally characterize and understand the latency variation across cells within a DRAM chip for these three fundamental DRAM operations, and (ii) develop new mechanisms that exploit our understanding of the latency variation to reliably improve performance. To this end, we comprehensively characterize 240 DRAM chips from three major vendors, and make several new observations about latency variation within DRAM. We find that (i) there is large latency variation across the cells for each of the three operations; (ii) variation characteristics exhibit significant spatial locality: slower cells are clustered in certain regions of a DRAM chip; and (iii) the three fundamental operations exhibit different reliability characteristics when the latency of each operation is reduced.Based on our observations, we propose Flexible-LatencY DRAM (FLY-DRAM), a mechanism that exploits latency variation across DRAM cells within a DRAM chip to improve system performance. The key idea of FLY-DRAM is to exploit the spatial locality of slower cells within DRAM, and access the faster DRAM regions with reduced latencies for the fundamental operations. Our evaluations show that FLY-DRAM improves the performance of a wide range of applications by 13.3%, 17.6%, and 19.5%, on average, for each of the three different vendors' real DRAM chips, in a simulated 8-core system. We conclude that the experimen-Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from permissions@acm.org. tal characterization and analysis of latency variation within modern DRAM, provided by this work, can lead to new techniques that improve DRAM and system performance.

This article summarizes key results of our work on experimental characterization and analysis of latency variation and latency-reliability trade-o s in modern DRAM chips, which was published in SIGMETRICS 2016 [24], and examines the work's signi cance and future potential. Our work is motivated to reduce the long DRAM latency, which is a critical performance bottleneck in current systems. DRAM access latency is de ned by three fundamental operations that take place within the DRAM cell array: (i) activation of a memory row, which opens the row to perform accesses; (ii) precharge, which prepares the cell array for the next memory access; and (iii) restoration of the row, which restores the values of cells in the row that were destroyed due to activation. There is signi cant latency variation for each of these operations across the cells of a single DRAM chip due to irregularity in the manufacturing process. As a result, some cells are inherently faster to access, while others are inherently slower. Unfortunately, existing systems do not exploit this variation.

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The energy consumption of DRAM is a critical concern in modern computing systems. Improvements in manufacturing process technology have allowed DRAM vendors to lower the DRAM supply voltage conservatively, which reduces some of the DRAM energy consumption. We would like to reduce the DRAM supply voltage more aggressively, to further reduce energy. Aggressive supply voltage reduction requires a thorough understanding of the effect voltage scaling has on DRAM access latency and DRAM reliability. In this paper, we take a comprehensive approach to understanding and exploiting the latency and reliability characteristics of modern DRAM when the supply voltage is lowered below the nominal voltage level specified by manufacturers.