A new surface mount power package is introduced in this paper. Today there is a great need for a true high power surface mount package. This power package was designed from the start with surface mountlng in mind. Thus it is suitable for aU reflow soldering methods. The main advantages of the package are excellent thermal performance, high power capability and high power density, versatility, thermal efndent and reliable soldering. This paper will show that the new PowerSO-10 TM is a perfect successor of the well-known TO-220 package for the SMT envlronment.
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