“…Metal oxides such as TiO x , [8,9,[40][41][42] NiO x , [32,[43][44][45][46] HfO 2 , [19,29,42] TaO x , [20,47,48] AlO x , [10,49] ZrO 2 , [15][16][17] ZnO x , [11,31,50] CuO, [6,51,52] SiO x , [18,34,53] and others are frequently used as materials for constructing the resistive layer due to their simple structure, larger bandgap, and better compatibility with the CMOS process. [54,55] At the same time, nitride such as AlN, [56,57] ZrN, [58] NiN, [59] and organic materials like Alq 3 [60] exhibit similar RS mechanisms to metal oxides, making them viable options for resistive materials.…”