Zero Waste and Biodegradable Zinc Oxide Thin-Film Transistors for UV Sensors and Logic Circuits

Nogueira, Gabriel Leonardo; Kumar, Dinesh; Zhang, Shoushou; Alves, Neri; Kettle, Jeff

doi:10.1109/ted.2023.3249126

Cited by 9 publications

(4 citation statements)

References 46 publications

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“…These materials are very attractive since they could make recycling easier. 295,296 In addition, there is the emerging area of biodegradable electronics that might also simplify recycling processes, 297 enabling recovery of higher value metals and components. In biocomposites, matrix material is selected to avoid epoxies or other petroleum based and non biodegradable polymers, allowing specic biocatalytic digestion of binders, and easy degradation of the polymer matrices.…”

Section: State Of the Art Of The Recycling Techniquesmentioning

confidence: 99%

A toolbox for improved recycling of critical metals and materials in low-carbon technologies

Zante,

Elgar,

Hartley

et al. 2024

RSC Sustain.

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Section: State Of the Art Of The Recycling Techniquesmentioning

confidence: 99%

A toolbox for improved recycling of critical metals and materials in low-carbon technologies

Zante,

Elgar,

Hartley

et al. 2024

RSC Sustain.

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“…The V T was calculated from the intercept on the voltage axis when extrapolating the linear sections of (I D − V G ) plots in the linear and I 1/2 − V G plots in the saturation regimes. The gate-voltage-dependence of the electron mobility was also extracted from transfer plots in the saturation regimes respectively using standard equations [14], i.e.,…”

Section: B Bias Stress Measurementsmentioning

confidence: 99%

Bias and Temperature Stress Effects in IGZO TFTs and the Application of Step-Stress Testing to Increase Reliability Test Throughput

Mohammadian,

Kumar,

Fugikawa-Santos

et al. 2023

Preprint

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<p>Indium-gallium-zinc-oxide thin-film transistors (IGZO TFTs) are widely used in numerous display applications and are emerging as a promising alternative for flexible IC production due to their high transparency, superior field-effect mobility, and low-temperature processability. However, their stability under different voltage stresses remains a concern, primarily due to carrier trapping in the gate dielectric and point defect creation. This study involves the fabrication of IGZO TFTs and their subsequent bias stress testing in linear and saturation regions. The impact of a passivation layer on top of the active channel is investigated to mitigate bias stress susceptibility. The passivated TFTs exhibit reduced bias stress susceptance, with ΔVT only moderately affected by the positive gate bias stress. This suggests that fewer electrons are being trapped at the interface between the dielectric/semiconductor. Conventional bias stress testing methods for TFTs are time-consuming and depend on airstable devices. To address this, we introduce a ‘Voltage Step Stress’ (VSS) approach. This method offers an accelerated way to conduct bias stress measurements without compromising test accuracy.</p>

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“…In 2020, 53.6 million tonnes of e-waste was generated, and only less than of that was collected 20 % for recycling. [1] The amount of e-waste generated is only growing [2]. On top of the end-of-life waste, there is a significant amount of greenhouse gas emissions produced during the production of electronic components -throughout the supply chain.…”

Section: Introductionmentioning

confidence: 99%

Evaluation of the Environmental Impact within Semiconductor Packaging Materials

Kettle,

Bainbridge,

Grant

et al. 2024

IMAPSource Proceedings

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This paper reports the sustainability of materials and components required for PCB manufacturing, namely the substrate material, die-attach method and IC chip design. Electronics manufacturing processes are generally decided by the technical and economic requirements, and not sustainability, resulting in poor practices and unintended outcomes. Alternative methods could be used and this paper reviews some of the drivers and opportunities for sustainable PCB manufacturing. A lifecycle assessment (LCA) was performed on simple Printed Circuit Boards (PCB) and a comparison of the manufacturing approach using FR-4, polyimide and paper-based substrates is made. The impacts of different processing steps were considered, all scored using the ReCiPe Endpoint. The results found solder material has a significant influence, with lower-temperature solders reducing the overall environmental impact. However, it has been found that the component that has the biggest environmental impact overall is the IC. We discuss how die size, technology node and packaging formats effects this rating, and also show how the move towards alternative materials can reduce the environmental impact of electronic products.

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Zero Waste and Biodegradable Zinc Oxide Thin-Film Transistors for UV Sensors and Logic Circuits

Cited by 9 publications

References 46 publications

A toolbox for improved recycling of critical metals and materials in low-carbon technologies

A toolbox for improved recycling of critical metals and materials in low-carbon technologies

Bias and Temperature Stress Effects in IGZO TFTs and the Application of Step-Stress Testing to Increase Reliability Test Throughput

Evaluation of the Environmental Impact within Semiconductor Packaging Materials

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