2010 IEEE Sensors 2010
DOI: 10.1109/icsens.2010.5690714
|View full text |Cite
|
Sign up to set email alerts
|

Zero offset drift suppression in SiC pressure sensors at 600

Abstract: Temporal drifts in zero pressure offset voltage, V oz , observed in piezoresistive silicon carbide (SiC) pressure sensors at 600 o C were significantly suppressed to allow reliable operation. By modifying the bondpad/contact metallization, the V oz relative drift velocity at 600 o C was suppressed to within ± 0.5 mV.hr-1 , for over 1000 hours. Microstructural changes within the contact metallization were analyzed with Auger Electron Spectroscopy (AES) and Scanning Electron Microscopy (SEM). This metallization … Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1
1
1
1

Citation Types

1
8
0

Year Published

2011
2011
2021
2021

Publication Types

Select...
5
1

Relationship

0
6

Authors

Journals

citations
Cited by 10 publications
(9 citation statements)
references
References 13 publications
1
8
0
Order By: Relevance
“…From the AES analysis, the PtSi zone reactions are well defined. No significant Au migration through the first PtSi layer is observed, thus further confirming the diffusion barrier property of PtSi against Au reported earlier [4,5]. The observed oxygen peak at about 1600 nm was due to a thin oxide layer that formed after the first furnace anneal.…”
Section: Failure Analysessupporting
confidence: 70%
See 3 more Smart Citations
“…From the AES analysis, the PtSi zone reactions are well defined. No significant Au migration through the first PtSi layer is observed, thus further confirming the diffusion barrier property of PtSi against Au reported earlier [4,5]. The observed oxygen peak at about 1600 nm was due to a thin oxide layer that formed after the first furnace anneal.…”
Section: Failure Analysessupporting
confidence: 70%
“…After photolithographic pattern definition the Pt layer was etched in 10:9:1 mixture of H 2 O:HCl:HNO 3 (aqua regia) at 67 o C for 8 minutes, then 70 o C for 35 seconds to create four contacts on the piezoresistors. This was the standard scheme used previously that did not completely prevent Au diffusion to the SiC interface, which compromise the integrity of the Ti ohmic contact to SiC [5,6]. In this present work, it was necessary to increase the contact metallization stack with alternating layers of TaSi 2 and Pt, which, upon reacting to form multiple PtSi layers, would create an effective diffusion barrier against Au to the SiC interface.…”
Section: Sample Preparationmentioning
confidence: 99%
See 2 more Smart Citations
“…17 Additionally, piezoresistive SiC pressure sensors which can operate at high temperatures have also been demonstrated. 18,19 For instance, Okojie et al developed 4H-SiC pressure sensors which can function up to 1000 K. 20 Although numerous studies have been conducted on SiC at high temperatures, the piezoresistance of the material at negative temperatures has rarely been reported. As low temperature tolerance is imperative in several elds (e.g.…”
Section: -12mentioning
confidence: 99%