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Medvedev, G. I.; Makrushin, N. A.; Dubenkov, A. N.

doi:10.1023/a:1024907817538

Cited by 4 publications

(3 citation statements)

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“…Medvedev et al also examined formation of low concentration Bi alloys (0.1 to 1.3%) using sulfate baths (SnSO 4 , Bi 2 (SO 4 ) 3 , H 2 SO 4 ) with Sn 2+ to Bi 3+ concentration ratios ranging from 5:1 to 25:1, in the presence of organic additives such as sintanol, formalin and benzyl alcohol. 17 The current efficiency of deposition increases with increasing Sn 2+ to Bi 3+ ratio. High leveling power and bright deposits are obtained for current densities of 4-6 A/dm 2 .…”

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confidence: 95%

“…Tin-bismuth alloys have been electrodeposited from different baths using direct-current and pulsed-current techniques [10][11][12][13][14][15][16][17][18][19][20][21][22][23][24][25]. The standard reduction potential of Bi 3+ is 444 mV nobler than that of Sn 2+ .…”

Section: Introductionmentioning

confidence: 99%

“…Further, it also smoothens the deposit surface and reduces dendritic growth by adsorbing on both Sn and Bi deposit and inhibiting further deposition. Medvedev et al also examined formation of low concentration Bi alloys (0.1 to 1.3%) using sulfate baths (SnSO4, Bi2(SO4)3, H2SO4) with Sn 2+ to Bi 3+ concentration ratios ranging from 5:1 to 25:1, in the presence of organic additives such as sintanol, formalin and benzyl alcohol [17]. The current efficiency of deposition increases with increasing Sn 2+ to Bi 3+ ratio.…”

Section: Introductionmentioning

confidence: 99%

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Electrodeposition of Tin-Bismuth Alloys: Additives, Morphologies and Compositions

Rajamani

Jothi

Datta

et al. 2018

J. Electrochem. Soc.

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Electrodeposition of tin-bismuth alloys on polycrystalline copper electrodes has been studied from an acidic bath comprising SnCl4, Bi(NO3)3, citric acid, poly(vinyl alcohol) and betaine. Using linear sweep voltammetry (LSV) and chronoamperometry (CA), co-deposition of tin and bismuth from the above bath has been examined. Bismuth (III) ions get reduced in a single-step, three-electron-transfer reaction while tin (IV) ions undergo a two-step reduction through the formation of tin (II) ions. Nitric acid in the bath not only enhances solubility of the precursors but also decreases the peak potential separation between bismuth (III) and tin (II) ions. Through the introduction of various additives and variation in bath pH, co-deposition is preserved while the composition of tin in the obtained alloy is modified. The morphologies, composition and crystallinity of the deposits have been determined using scanning electron microscopy, inductively coupled plasma atomic emission spectroscopy and X-ray diffraction, respectively. A wide range of alloy compositions (from 14% to 75% tin), including the eutectic Sn-Bi alloy have been deposited. Novel morphologies such as yarns-of-spool have been obtained.

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mentioning

confidence: 95%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Electrodeposition of Tin-Bismuth Alloys: Additives, Morphologies and Compositions

Rajamani

Jothi

Datta

et al. 2018

J. Electrochem. Soc.

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Electrodeposition of lead‐free solder alloys

Goh

Haseeb

Sabri

2013

Soldering &Amp; Surface Mount Technology

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PurposeThe purpose of this paper is to enhance the understanding on the electrodeposition of various lead (Pb)‐free solder alloys, so that new studies can be carried out to solve processing issues.Design/methodology/approachThe paper reviews the available reports on the electrodeposition of tin (Sn)‐based solder systems and identifies the challenges in this area.FindingsCompositional control remains a major challenge in this area, where the achievement of desired composition for binary and ternary alloys is subjected to uncertainties. The use of chelating agents in the bath and optimization of parameters can assist the achievement of near‐desired alloy composition. Acidic plating baths are preferred due to their compatibility with photoresists but oxidation of stannous ions causes poor bath stability. Antioxidants, reducing agents and low oxygen overpotential anodes can suppress the oxidation rate and increase the lifespan of plating baths. Apart from chelating agents and antioxidants, various categories of additives can be added to improve quality of deposits. Surfactants, grain refiners and brighteners are routinely used to obtain smooth, fine‐grained and bright deposits with good thermo‐mechanical properties.Originality/valueThe paper provides information on the key issues in electrodeposition of Pb‐free solder alloys. Possible measures to alleviate the issues are suggested so that the electrodeposition technique can be established for mass production of a wider range of solder alloys.

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