XPS and HRTEM characterization of cobalt–nickel silicide thin films

Application of angle‐resolved XPS for characterisation of SiC/Ni2Si thin film systems

“…The low silicide peak intensity is due to the small coating thickness. The binding energy of the Ni 2p 3/2 at ¾853.2 eV corresponds to Ni 2 Si and is further evidenced by the absence of the characteristic Ni peak and its satellites 6 ( Fig. 1(c)).…”

“…5 Nickel has been used extensively as the transition metal for the formation of the contact with SiC because of its ability to form stable silicides yielding low contact resistivity. 4,6,7 Different silicides may form as a result of Ni/SiC reaction above 400°C, but the dominant species, Ni 2 Si, is reported to have an ohmic behaviour after heat treatment at above 900°C. 3,4 This behaviour is supposed to be related to the graphite formation on the Ni 2 Si surface, leading to vacancies and electron donors due to tunnelling processes that contribute to the Ni 2 Si/SiC contact properties.…”

Chemical and morphological characterizations of CoNi alloy nanoparticles formed by co-evaporation onto highly oriented pyrolytic graphite

“…Although such studies have been carried out for several decades, on substrates as varied as Si, Ga, As, Pt, Pd and highly oriented pyrolytic graphite (HOPG) [4][5][6][7][8][9], most of these studies were confined to pure metal NPs. Recently, bimetallic NPs have become an interesting research field due to certain properties of nanoscale alloys, which may exist in a number of structures and phases that are different from those of the corresponding bulk metals [10,11].…”

Sputter deposition and XPS analysis of nickel silicide thin films

“…low and stable electrical resistivity) even in nanoscale dimensions [1][2][3][4]. Moreover, their physical and chemical properties including high hardness, low density and high chemical resistivity due to the formation of Si-rich oxide film, as well as their low manufacturing cost in comparison to other transition metal silicides make them attractive for the functional material applications [5][6][7].…”