X-Ray Measurement of Faulting in Evaporated α Cu–Ge Films

Marchetto, G.; Vook, R.W.; Bourgault, Rébecca

doi:10.1116/1.1492596

Cited by 6 publications

(3 citation statements)

References 0 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…An x-ray study of silver films (thickness 2000 and 6000 A) prepared at different residual gas pressures has been made by Light and Wagner (1966) to determine particle size, strains and faulting from the lattice parameter measurements and Fourier analysis of line shapes. The lattice parameter and stacking fault probabilities in a-Cu-Ge films as a function of composition have been measured by Marchetto et al (1968) by an x-ray diffraction method. An x-ray line broadening analysis in gold films less than 1000 A thick has been made by Atasagun and Vook (1970) to determine the crystallite size and non-uniform strains in the films.…”

Section: Introductionmentioning

confidence: 99%

An x-ray line shift analysis in vacuum-evaporated silver films

Sen

Halder

Gupta

1973

J. Phys. D: Appl. Phys.

View full text Add to dashboard Cite

Thin films of silver of thickness 58-212 nm (580-2125 Å) were prepared by evaporation on glass substrates at a residual air pressure of similar 10−5 Torr, and x-ray diffraction line profiles were chart-recorded on a Geiger counter x-ray diffractometer at room temperature using Cu Kα radiation. The peak positions of 111, 200, 220 and 311 reflections were measured, and from the peak shifts of adjacent pairs of reflections the lattice parameter changes, residual stresses and stacking fault concentrations in the films were determined as a function of film thickness. In relatively thin films (<100 nm), an appreciable decrease in the lattice parameter from the bulk value and a predominance of extrinsic stacking faults were observed. The residual stresses in the plane of the films were found to be compressive in nature, varying from similar 0·17 to similar 0·01×1010 N m−2 (similar 24 to similar 1×104 psi) with the increase in thickness. The results have been analysed and discussed in the light of existing work on thin metallic films.

show abstract

Section: Introductionmentioning

confidence: 99%

An x-ray line shift analysis in vacuum-evaporated silver films

Sen

Halder

Gupta

1973

J. Phys. D: Appl. Phys.

View full text Add to dashboard Cite

show abstract

“…The partially annealed specimen also shows considerable faulting (p -45.6 x 10-3). The high incidence of growth faults (p) in these alloy films is inconsistent withMarchetto et al (1968), for a-Cu-Ge films.…”

mentioning

confidence: 75%

An X-ray diffraction study on the lattice imperfections in vapour-deposited FCC (Ag-4.5 at.% Ge) alloy films

Sen¹,

Gupta²

1978

J. Phys. D: Appl. Phys.

View full text Add to dashboard Cite

Fourier analyses of both multiple and single-order reflections in FCC (Ag-4.5 at.% Ge) alloy films (68 to 238 nm thick) indicated appreciable coherent domain size and lattice strain effects with slight lattice contraction and significant compressive long-range residual stress. The study further reveals large concentrations of growth twin stacking faults but none that were intrinsic or extrinsic. The films showed a high dislocation density and a strong preferential texture along (111).

show abstract

“…The microstructure of powder samples of metals and alloys has been extensively studied [3][4][5], by x-ray diffraction method over the period of last two decades and many important advancements have been made in the theory and application by such studies. However, only a few corresponding studies [6][7][8][9][10][11][12][13][14][15] have been reported in the thin films of metals and alloys. The main reasons are that (i) the microcrystallites in thin films are not randomly deposited such as found in powders, (ii) films should be very uniform, sufficiently thick and good quality for XDS measurement, and (iii) the corrections due to geometrical effect and preferred orientation are not easy to perform experimentally.…”

Section: Introductionmentioning

confidence: 99%

Structure and Properties of Vacuum-Deposited Cadmium Thin Films

Halder

1979

Zeitschrift Für Naturforschung A

View full text Add to dashboard Cite

Thin films of Cd were prepared by vacuum deposition onto glass plates at temperature of 45 °C and pressure of about 10~6 torr. Several good quality films of various thicknesses (15,000 ~ 28,000 Ä) were made. The films were characterized by strong preferred orientation along the 002 planes parallel to the surface of the substrate, which were found to be thickness dependent. In particular, the 002, 100 and 004 peaks were many times stronger than their corresponding diffraction peaks obtained from powder specimens. Both the real and imaginary parts of the Fourier coefficients were considered for line broadening analysis. The particle size (which is also called the average size of the coherently diffracting domains in a direction perpendicular to the diffracting planes), microstrain (which is usually called the mean strain in a given direction) and faulting were determined. A systematic study for all the diffraction peaks indicates an increase of average particle size J) from 546 to 620 A in the above thickness range with no apparent anisotropy for the 100, 002 and 004 directions. The microstrain, however, decreased as much as 50% in this thickness range and showed a considerable amount of anisotropy. The fault parameters a (deformation fault probability) and ß (growth fault probability) decreased rather rapidly for all directions.

show abstract

X-Ray Measurement of Faulting in Evaporated α Cu–Ge Films

Cited by 6 publications

References 0 publications

An x-ray line shift analysis in vacuum-evaporated silver films

An x-ray line shift analysis in vacuum-evaporated silver films

An X-ray diffraction study on the lattice imperfections in vapour-deposited FCC (Ag-4.5 at.% Ge) alloy films

Structure and Properties of Vacuum-Deposited Cadmium Thin Films

Contact Info

Product

Resources

About