WR-3.4 Overmoded Waveguide Module for the Packaging of a Linear Integrated-Circuit Array

Abstract

The performance of WR-3.4 overmoded waveguide modules containing a linear array of discrete terahertz integrated circuits is presented to verify a new power-combining technique. Custom-designed thru-line IC chips that include back-to-back broadband antenna transitions were fabricated with an area of 390 × 750 mm2 for waveguide packaging. Multiple array modules were assembled to verify the repeatability in performance. The array modules exhibited almost identical amounts of insertion losses compared with single-element modules, showing the best insertion loss of 2.6 dB over a 1 dB bandwidth of 95 GHz.

Boosting the performance of low‐cost eco‐friendly pyramidal absorbers with a Salisbury screen

“…However, in literature, several papers suggest an easier technique: measurements in a rectangular waveguide. Hollow (rectangular) waveguides have been widely used for measuring not only common pyramidal absorbers [14], but also structures with absorber films [36], Salisbury screens, and Jaumann (multi‐layers Salisbury screens) [37] and graphene‐based absorbers [38]. It has to be noted that the propagation mode in a rectangular waveguide is TE, while pyramidal absorbers in free space normally operate in TEM mode.…”

WR‐3.4 multi‐mode waveguide module with single‐chip‐integrated array circuits

“…Improving power capability is a significant concern in the terahertz frequency band, given that single active solid-state devices typically generate powers within the range of around 1 mW [4][5][6]. As an example of multiple element packaging, four separately diced IC chips were positioned inside a waveguide with a widened E-plane channel, producing behavior nearly identical to that of single-element waveguide modules [7]. In constructing the array module, careful attention was given to maintaining perfect cell-to-cell symmetry.…”