Wire Electro-Discharge Grinding for Micro-Machining

Masuzawa, Takahisa; Fujino, Masataka; Kobayashi, Kenichi; Suzuki, Takehito; Kinoshita, N.

doi:10.1016/s0007-8506(07)61805-8

Cited by 526 publications

(223 citation statements)

References 1 publication

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“…It is therefore only possible to drill small holes with the use of very fine tools. In this case, 100-µm-diameter needles were fabricated by wire electro-discharge grinding (in-house prototype) [20,21], and were used to pierce 200 µm diameter holes through a 525-µm-thick wafer, as depicted in Fig. 3.…”

Section: Resultsmentioning

confidence: 99%

Multi-layer microfluidic glass chips for microanalytical applications

Daridon

Fascio

Lichtenberg

et al. 2001

Fresenius J Anal Chem

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A new, versatile architecture is presented for microfluidic devices made entirely from glass, for use with reagents which would prove highly corrosive for silicon. Chips consist of three layers of glass wafers bonded together by fusion bonding. On the inside wafer faces a network of microfluidic channels is created by photolithography and wet chemical etching. Low dead-volume fluidic connections between the layers are fabricated by spark-assisted etching (SAE), a computer numerical controlled (CNC)-like machining technique new to microfluidic system fabrication. This method is also used to form a vertical, long path-length, optical cuvette through the middle wafer for optical absorbance detection of low-concentration compounds. Advantages of this technique compared with other, more standard, methods are discussed.When the new glass-based device for flow-injection analysis of ammonia was compared with our first-generation chips based on silicon micromachining, concentration sensitivity was higher, because of the longer pathlength of the optical cuvette. The dependence of dispersion on velocity profile and on channel cross-sectional geometry is discussed. The rapid implementation of the devices for an organic synthesis reaction, the Wittig reaction, is also briefly described.

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Section: Resultsmentioning

confidence: 99%

Multi-layer microfluidic glass chips for microanalytical applications

Daridon

Fascio

Lichtenberg

et al. 2001

Fresenius J Anal Chem

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“…They can produce the feature size down to a few microns with possible aspect ratio of 100 [2]. Specifically, micro Wire Electro-Discharge Grinding (WEDG), firstly introduced by Masuzawa [9] in 1985, is also regarded as an important micro-EDM configuration. This process is broadly used for forming very thin rods with high-aspect ratio, which are used as tool electrodes for micro-EDM drilling.…”

Section: Characteristics Of Micro-edmmentioning

confidence: 99%

Process capabilities of Micro-EDM and its applications

Liu

Lauwers

Reynaerts

2009

Int J Adv Manuf Technol

137

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The Micro Electrical Discharge Machining (Micro-EDM) process has proved to be an appropriate nonconventional machining method for manufacturing accurate and complex three-dimensional structural microfeatures which are difficult to be produced by conventional processes. However, the miniaturisation of the EDM process requests special requirements on the machining equipments. Pulse generators, which can produce small input energy pulses, and high precision systems are the two major criterions. In this paper, newly developed advanced technologies regarding to these aspects are explored with the aid of a commercial micro-EDM machine. First of all, by examining the pulses, innovative strategies implemented in the pulse generator are studied. Indepth research also reveals the correlation between the discharge pulses and the machine parameters in order to provide an indicative overview of process capability. Secondly, precision machining, which is represented by producing a three-dimensional micro-structure such as a micro-compressor, is demonstrated. Accordingly, by examining the machining geometry and surface integrity, process characteristics of micro-EDM are discussed.

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“…While small steps were taken at improving these hole-drilling machines, a major step was taken toward improving micro-EDM as a process with the advent of wire-electro discharge grinding, or WEDG (Masuzawa 1985(Masuzawa , 1986). The WEDG process is used to make very small, precise shafts, examples of which can be seen in the citations (Masaki 1990).…”

Section: Existing Micro-edm Systemsmentioning

confidence: 99%