Wetting in the Au–Sn System

Cross-Interaction Between Au/Sn and Cu/Sn Interfacial Reactions

“…As has been reported previously in single Sn/Au interfacial reaction studies, the platelike AuSn 4 compound grew into the Sn matrix and an AuSn 2 layer formed between the AuSn 4 and Au layers. 3,9,10 As seen in Fig. 2a-f, the AuSn 4 compound did not seem to grow much after prolonged reflow; instead, the interfacial AuSn 2 layer grew at the expense of the AuSn 4 phase.…”

Ternary intermetallic compounds in Au–Sn soldering systems—structure and properties

“…Since these solder joints are expensive, the addition of small amounts of Sb to the binary AuSn solders has been discussed to reduce the costs and to improve the thermomechanical behavior while extra In may reduce the thermal fatigue and increase the ductility [6,7]. The intermetallic compound AuSn is essential for the wetting of the Au-rich solder and is formed as first phase in the solidification of the Sn-rich Au-Sn solder [8][9][10][11][12]. It has been described in the NiAs structure type with lattice parameters of a & 4.32 Å and c & 5.52 Å [13,14].…”

Wetting Behavior of Calcium Ferrite Melts on Sintered MgO

“…Formidable impediments exist in definitive experimental and theoretical conditions. 29) On one hand, the reaction altered the original interface properties; on the other hand, it resulted in another reaction in the liquid phase. In this study, iron-magnesium spinel was generated on MgO substrate; at the same time, C 2 F was generated in the liquid phase, and the viscosity of the liquid was obviously increased by the existence of C 2 F. The added Al 2 O 3 , SiO 2 , and TiO 2 could react with CaO and generate solid phase 2CaO·Al 2 O 3 , 2CaO·SiO 2 , and CaO·TiO 2 as the MgO dissolved into the slag.…”