Cross-Interaction Between Au/Sn and Cu/Sn Interfacial Reactions

Yen, Yee‐Wen; Tseng, How; Zeng, Ke; Wang, S. J.; Liu, C. Y.

doi:10.1007/s11664-009-0920-2

Cited by 16 publications

(11 citation statements)

References 13 publications

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“…Minor dissolution of Co may affect interfacial reactions at the Cu/solder interface; the same is observed for solder/Co and solder/Ni interfaces, as reported for Au/Sn/Cu, 6,7 Pt/ Sn/Cu, 8 and Cu/Sn/Ni 9-11 systems. In the Au/Sn/Cu couple at 250°C, and in the Cu 6 Sn 5 phase, the AuSn 4 phase is formed at the Sn/Cu interface.…”

Section: Introductionsupporting

confidence: 67%

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Cross-Interaction in Cu/Sn/Co/Sn/Ni and Cu/Sn–Co/Co/Sn– Co/Ni Couples

Chen

Tseng

2015

Journal of Elec Materi

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In this study we examined cross-interactions of Cu/Co and Co/Ni by use of Cu/ Sn/Co/Sn/Ni and Cu/Sn-0.04 wt.% Co/Co/Sn-0.04 wt.% Co/Ni couples. In the Cu/Sn/Co couple, Cu can diffuse through the pure Sn solder, and the (Cu, Co) 6 Sn 5 phase is formed at the Co side. The rate of consumption of Co decreases in the presence of Cu. Adding 0.04 wt.% Co to the pure Sn solder blocks diffusion of Cu; the (Cu, Co) 6 Sn 5 phase at the Co side is not observed, and the rate of Co consumption is increased. In the Co/Sn/Ni couple, no noticeable Co and Ni diffusion is observed. When 0.04 wt.% Co is added, the ternary (Ni, Co)Sn 4 phase is formed at the Ni side. These results indicate Co is an effective barrier to diffusion of Cu which can be used in flip chip packaging of Cu/low-k chips.

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Section: Introductionsupporting

confidence: 67%

“…No noticeable Cu content is detected in Au-Sn intermetallics. 6 However, Chang et al reported that the Cu flux is two to three times the Au flux in the Au/Sn/Cu couple at 200°C. 7 In the Pt/Sn/Cu couple at 250°C, the rate of growth of the PtSn 4 phase at the Pt/Sn interface is reduced by the presence of Cu.…”

Section: Introductionmentioning

confidence: 99%

Cross-Interaction in Cu/Sn/Co/Sn/Ni and Cu/Sn–Co/Co/Sn– Co/Ni Couples

Chen

Tseng

2015

Journal of Elec Materi

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“…This has been observed in other systems such as Pt/Sn/Cu, 11 Cu/Sn/Ni, 12,13 and Cu/Sn/Au. 14 A similar problem has also been observed for Cu/SnIn bonding with Cu/Sn-In. 15 In this work, the properties of the bonded Cu/SnIn (at noneutectic compositions) interface were investigated.…”

Section: Introductionsupporting

confidence: 55%

“…It can be seen that IMC has not formed in unannealed samples. Based on EDS measurements, the IMC that forms in annealed samples has a composition in the range of (53-64)Cu-(24-34)Sn- (7)(8)(9)(10)(11)(12)(13)(14)In. According to the ternary Cu-Sn-In phase diagram, 19 this composition corresponds to the g-phase [Cu 6 (Sn,In) 5 ], which is consistent with the observed XRD peaks.…”

Section: Microstructure Analysismentioning

confidence: 99%

Influence of Bonding Parameters on the Interaction Between Cu and Noneutectic Sn-In Solder Thin Films

Sasangka

Gan

Thompson

et al. 2011

Journal of Elec Materi

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Thermocompression bonding of through-layer copper interconnects is of great interest for fabrication of three-dimensional (3D) integrated circuits. We have investigated interactions of Cu films with noneutectic Sn-In at length scales of 1 lm to 5 lm. The effects of bonding time, bonding temperature, and postbonding annealing temperature on intermetallic compound (IMC) formation, joint microstructure, and shear strength were investigated using scanning electron microscopy (SEM), energy-dispersive x-ray spectroscopy (EDS), x-ray diffractometry (XRD), and shear testing. It is shown that bonding temperature plays an important role in increasing the true contact area, while the postbonding annealing temperature affects the formation of a single IMC, the g-phase [Cu 6 (Sn,In) 5 ]. Both of these phenomena were found to contribute to the shear strength of the joints. It is shown that two-step bonding processes, involving short bonding times and longer postbonding annealing, can be used to optimize the bond formation for increased throughput.

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“…2 In flip-chip solder joints, the Cu/solder/Co sandwich structure is encountered. There have been some studies on various sandwich solder joints, [6][7][8][9][10] i.e., Cu/Sn/Ni and Cu/Sn/Au. For the Cu/Sn/Ni diffusion couple, the interfacial reaction on the Ni side is greatly affected by Cu, because Cu dissolves into solders in the reflow process and its mobility is very high in solders.…”

Section: Introductionmentioning

confidence: 99%