Wetting behaviour of eutectic tin/lead solder and fluxes on copper surfaces

Matienzo, Luis J.; Schaffer, R. R.

doi:10.1007/bf00588316

Cited by 11 publications

(4 citation statements)

References 6 publications

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“…This result shows that high temperature is not suitable for this cleaning product. At high temperature, the cleaning solution could undergo "surfactant separation" segregate, where individual raw materials can precipitate and hence affect the cleaning consistency (Matienzo and Schaffer, 1991). At 858C, the cleaning solution becomes fully soluble and loses its cleaning properties.…”

Section: Ic Sample Preparationmentioning

confidence: 99%

Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology

Yap

Talik

Sauli

et al. 2013

Microelectronics International

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Purpose -This paper aims to discuss the effects of ionic contaminations on the die surface of high lead flip chip ball grid array (FCBGA) package. Ionic contaminations from the flux residue, formed during the die attachment process, could affect the package long-term performance. Design/methodology/approach -Thus, the flux-cleaning process was implemented and the cleanliness effect was evaluated. Cleaning experiments using a new water-based solvent were carried out to investigate the flux-cleaning efficiency. The test packages were then evaluated via ion chromatography (IC). Findings -Ion chromatograms show that there are high levels of ionic elements detected prior to the cleaning process. After the cleaning process, the contamination levels reduced significantly. Originality/value -The value of the work here is testing of the new environmental friendly water-based MPC w cleaning efficiency. The reduction of ionic contamination is thus reported.

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Section: Ic Sample Preparationmentioning

confidence: 99%

Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology

Yap

Talik

Sauli

et al. 2013

Microelectronics International

View full text Add to dashboard Cite

show abstract

“…This phenomenon can be measured quantitatively by measuring the contact angle made by the solder with the substrate, as shown in Figure 1a, or by using a wetting balance as shown in Figure 1b and measuring the force exerted on the solid substrate material when it is inserted into a bath of molten solder. Most solder alloys make wetting angles in the range of 10° to 20° with the substrate material; 17,18 situations that result in higher contact angles are avoided.…”

Section: Wetting and Bondingmentioning

confidence: 99%

Physical metallurgy in lead-free electronic solder development

Subramanian

Lee

2003

JOM

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physical metallurgy principles play significant roles in the pursuit of suitable substitutes for traditional lead-based solders in the electronic industry. Phase diagrams, alloy development, solidification, diffusion, wetting, aging, precipitation of second-phase particles, microstructural coarsening, temperature effects, thermomechanical behavior, and creep are among the issues to be considered. This article focuses on the importance of physical metallurgy in these developments. BACKGROUND

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“…The eutectic Sn-Pb (Sn63-Pb37) alloy has been used in electronic assemblies for decades and the wettabilities of the eutectic Sn-Pb solder have been assessed on copper or gold-plated copper substrates using the wetting balance test or the spreading test. A spreading test was conducted to evaluate the wettability of eutectic Sn-Pb solder balls on copper substrates (Matienzo and Schaffer, 1991). The solder balls were coated with RMA flux, and then heated to and held at 2498C to observe the spreading characteristics of the solder on copper substrates.…”

Section: Introductionmentioning

confidence: 99%

“…In comparison with the wetting balance test, the spreading test, in which solder pastes can be used and heated following a temperature profile, is a more practical approach to simulation of reflow soldering. Although the spreading test has been used in evaluating wettabilities of solders, including the eutectic Sn-Pb solder and some newly developed lead-free solders, solder preforms such as solder balls and wires coated with flux were typically used in these tests (Matienzo and Schaffer, 1991;Kim and Tu, 1996). These solder preforms were heated directly to some constant temperatures and held at that temperature for some time duration.…”

Section: Introductionmentioning

confidence: 99%

Wettability test method for surface mount technology assessment

Natishan²

2000

Soldering &Amp; Surface Mount Technology

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A study was performed to develop a different experimental methodology to assess wettabilities of solders on various printed wiring board (PWB) finishes, based on a modified spreading test in which solder pastes were heated following temperature reflow profiles representative of those used in surface mount technology (SMT) instead of using a fixed rate temperature ramp. Three solder alloys (Sn63‐Pb37, Sn96.5‐Ag3.5, and CASTINTM: Sn96.2‐Ag2.5‐Cu0.8‐Sb0.5), two fluxes (rosin, mildly activated, RMA, and no‐clean, NC), and seven PWB finishes (Pd, Au/Ni, Ni, Ag, Sn, and organic solderability preservatives: OSP), and bare copper were involved in the study. Better wettabilities were observed in the current study than the results reported in the literature for conventional tests on the same combination of solder alloy, flux, and substrate. The different results in measurement of wettabilities obtained in the current study were attributed to the more adequate heating process allowing flux activation, which reduced reoxidation of solder powders and substrates during the reflow process and thus improved wettabilities of solders. Compared to the results obtained from the popular wetting balance test, the current study demonstrated a more realistic simulation of, and approach to, assessing the wettability of solder for SMT.

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Wetting behaviour of eutectic tin/lead solder and fluxes on copper surfaces

Cited by 11 publications

References 6 publications

Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology

Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology

Physical metallurgy in lead-free electronic solder development

Wettability test method for surface mount technology assessment

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