WETTING BEHAVIOR IN ULTRASONIC VIBRATION-ASSISTED BRAZING OF ALUMINUM TO GRAPHITE USING Sn-Ag-Ti ACTIVE SOLDER

Yu, Wei-Yuan; Liu, Sen-Hui; Liu, Xinya; Shao, Jia-Lin; Liu, Min-pen

doi:10.1142/s0218625x15500353

Cited by 8 publications

(7 citation statements)

References 12 publications

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“…The surface of a steel sample working with a moist ring shows a decrease in roughness after 15 min. At this stage of research the theory already confirms that the presence of water affects the lubricating properties of these materials [11,14,15].…”

Section: Surface Roughnessmentioning

confidence: 93%

“…According to one theory [7] graphite shows good lubricating properties due to water adsorption. The adsorbed water molecules on the main sliding planes reduce the adhesion between them and thus reduce the coefficient of friction as they slide [11,14,15]. The problem turns out to be that too much water washes away the resulting graphite wear particles, which are necessary for the formation of the sliding layer [16].…”

Section: Introductionmentioning

confidence: 99%

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Effect of Steel Surface Roughness and Expanded Graphite Condition on Sliding Layer Formation

2021

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The aim of the research was to evaluate the influence of the initial roughness of a steel pin cooperating with a graphite ring—dry and wet—on the mechanism of sliding layer formation. A ring–pin friction pair was used for the study, where the rings were made of expanded graphite, while the pins were made of acid-resistant steel. In the first case, the steel pin interacted with a dry graphite ring, and in the second case, the graphite rings were moist. To determine the effect of initial surface roughness, the pins were divided into three roughness groups. To determine changes in surface geometry due to material transfer, the Ra and Rz parameters were measured. This project investigated how the initial roughness value of the steel surface pin cooperating with expanded graphite influences the formation of the sliding layer. Increasing the initial roughness of the steel surface interacting with the graphite contributes to faster layer formation and reduced roughness. The state of the expanded graphite—dry and wet—influences the formation of the sliding layer of graphite—a wet graphite component causes a faster smoothing of the steel surface. The running time of the wear apparatus has an effect on the resulting layer. The highest roughness group is the most favorable from the viewpoint of sliding layer formation.

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Section: Surface Roughnessmentioning

confidence: 93%

Section: Introductionmentioning

confidence: 99%

Effect of Steel Surface Roughness and Expanded Graphite Condition on Sliding Layer Formation

2021

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“…Another investigated aspect of the Sn-Ag-Ti-based solder was its spreadability on porous graphite when applying ultrasonic vibrations. The authors' results [10,11] have shown that the application of ultrasonic waves during soldering allows the active solder to spread on the surface of the graphite at a relatively low temperature under atmospheric conditions. The oxide layer on the molten solder forms a compact layer of a certain thickness which prevents the liquid solder from wetting the base material.…”

Section: Soldering With Active Soldersmentioning

confidence: 99%

Soldering by the Active Lead-Free Tin and Bismuth-Based Solders

Koleňák¹,

Provazník²,

Kostolný³

2019

Lead Free Solders

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The chapter deals with Sn and Bi-In-based lead-free solders. The term "active solders" is used for the solders which contain one or more elements with enhanced affinity to some element contained in the substrate material. Mainly, Ti, In, lanthanides, etc. belong amongst the active metals. The role of an active element is to ensure a good wetting by a reactive decomposition of the surface layer of substrate. The perspective solders for joining the combined materials, as ceramics/metal, are mainly the tin-based, lead-free solders, which are enriched with titanium (usually up to 4 wt. %). The advantage consists in the fact that they offers a sufficient plasticity reserve, by what they are capable to compensate undesired residual stresses formed in the joint. Titanium also reacts with carbon, nitrogen or oxygen of the ceramic material, eventually it forms the intermetallic phases, which increase the strength of joint interface. The Sn-Ti, SnAg -Ti and Bi-In-Sn solders were selected for the experiments. These solders were applied for fabrication of Al 2 O 3 ceramics/Cu joints. The phase composition and microstructure of solders and soldered joints was analysed. Interactions in the interface of ceramic/solder and Cu substrate/solder were determined. The shear strength of soldered joints was measured

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“…The effect of ultrasound on bond formation between the solder alloyed with Ti and a semiconductor or ceramic substrate is documented in several professional publications [25][26][27][28][29].…”

Section: Introductionmentioning

confidence: 99%

Characterization of Soldering Alloy Type Bi-Ag-Ti and the Study of Ultrasonic Soldering of Silicon and Copper

Koleňák

Kostolný

Drápala

et al. 2021

Metals

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The aim of the research work was to characterize the soldering alloy type Bi-Ag-Ti and to study the direct soldering of silicon and copper. Bi11Ag1.5Ti solder has a broad melting interval. Its scope depends mainly on the content of silver and titanium. The solder begins to melt at the temperature of 262.5 ∘C and full melting is completed at 405 ∘C. The solder microstructure consists of a bismuth matrix with local eutectics. The silver crystals and titanium phases as BiTi2 and Bi9Ti8 are segregated in the matrix. The average tensile strength of the solder varies around 42 MPa. The bond with silicon is formed due to interaction of active titanium with the silicon surface at the formation of a reaction layer, composed of a new product, TiSi2. In the boundary of the Cu/solder an interaction between the liquid bismuth solder and the copper substrate occurs, supported by the eutectic reaction. The mutual solubility between the liquid bismuth solder is very limited, on both the Bi and the Cu side. The average shear strength in the case of a combined joint of Si/Cu fabricated with Bi11Ag1.5Ti solder is 43 MPa.

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WETTING BEHAVIOR IN ULTRASONIC VIBRATION-ASSISTED BRAZING OF ALUMINUM TO GRAPHITE USING Sn-Ag-Ti ACTIVE SOLDER

Cited by 8 publications

References 12 publications

Effect of Steel Surface Roughness and Expanded Graphite Condition on Sliding Layer Formation

Effect of Steel Surface Roughness and Expanded Graphite Condition on Sliding Layer Formation

Soldering by the Active Lead-Free Tin and Bismuth-Based Solders

Characterization of Soldering Alloy Type Bi-Ag-Ti and the Study of Ultrasonic Soldering of Silicon and Copper

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