Characterization of Soldering Alloy Type Bi-Ag-Ti and the Study of Ultrasonic Soldering of Silicon and Copper

Koleňák, Roman; Kostolný, Igor; Drápala, Jaromír; Babincová, Paulína; Gogola, Peter

doi:10.3390/met11040624

Cited by 3 publications

(3 citation statements)

References 27 publications

(32 reference statements)

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“…The characterization of the soldered product was performed using macrographic examination [35,36]. The visual analysis of all the soldered samples led to the conclusion that a pattern related to material imperfections can be detected in a joint.…”

Section: Macrographic Examinationmentioning

confidence: 99%

Microwave Soldering of Low-Resistance Conductive Joints—Technical and Economic Aspects

et al. 2023

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Soldering processes are applied in the fabrication of electronic circuits used in most modern domestic and industrial technologies. This article aims to introduce a new soldering technology based on the microwave joining of copper materials used in electronic applications. The study was focused on microwave technology used as the thermal source for soldering. A simulation model of temperature distributions in copper plates with overall dimensions of 50 × 10 × 0.8 mm was developed in order to determine the necessary microwave power for soldering. For 270 °C simulated on the surface of copper plates, the microwave-injected power was determined to be 598.89 W. An experimental program for 600, 650, 700, and 750 W was set in order to achieve soldering of copper plates in less than 1 min. Soldered copper plates were subject to electrical resistance measurements being obtained with variations up to ±1.5% of the initial electrical resistance of the base materials. The quality of joints has also been analyzed through microscopy after the soldering process. In addition, mechanical properties were determined using a universal testing machine. The results have shown similar behavior of the samples layered with SAC on the one-side and double-side but also a significantly lower force before breaking for one-side-layered samples. An economic analysis was performed and the results obtained have shown that in terms of energy efficiency and total costs for microwave soldering compared with manual soldering, microwave soldering is cost-effective for industrial processing.

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Section: Macrographic Examinationmentioning

confidence: 99%

Microwave Soldering of Low-Resistance Conductive Joints—Technical and Economic Aspects

et al. 2023

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“…For such purposes, these so-called active solders are being designed nowadays, alloyed with an active element and able (under certain conditions) to create a bond also with ceramic materials, semiconductors, or glass materials. The effects of the active elements in the solders destined for soldering diverse materials are well documented in our previous works [16][17][18]. In those works, we focused on the joining of diverse ceramic materials with metals by applying a progressive hybrid soldering technology, namely hot plate/ultrasound.…”

Section: Introductionmentioning

confidence: 99%

Characterization of Zn-Mg-Sr Type Soldering Alloy and Study of Ultrasonic Soldering of SiC Ceramics and Cu-SiC Composite

Koleňák¹,

Pluhar²,

Drápala

et al. 2023

Materials

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The aim of the research was to characterize the soldering alloy type Zn-Mg-Sr and direct the soldering of SiC ceramics with Cu-SiC-based composite. It was investigated whether the proposed composition of the soldering alloy was appropriate for soldering those materials at the defined conditions. For the determination of the solder melting point, TG/DTA analysis was applied. The Zn-Mg system is of the eutectic type with a reaction temperature of 364 °C. The effect of strontium on the phase transformation was minimal, owing to its lower content. The microstructure of the soldering alloy type Zn3Mg1.5Sr is formed of a very fine eutectic matrix containing segregated phases of strontium—SrZn13 and magnesium—MgZn2 and Mg2Zn11. The average tensile strength of the solder is 98.6 MPa. The tensile strength was partially increased by solder alloying with magnesium and strontium. The SiC/solder joint was formed due to the distribution of magnesium from the solder to the boundary with the ceramics at the formation of a phase. Owing to soldering in air, oxidation of the magnesium took place and the oxides formed were combined with the silicon oxides that remained on the surface of the ceramic material—SiC. Thus, a strong bond based on oxygen was obtained. An interaction between the liquid zinc solder and the copper matrix of the composite substrate took place at the formation of a new phase—γCu (Cu5Zn8). The shear strength was measured on several ceramic materials. The average shear strength of the combined SiC/Cu-SiC joint fabricated with Zn3Mg1.5Sr solder was 62 MPa. When soldering similar ceramic materials mutually, a shear strength of as much as around 100 MPa was observed.

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“…In the case of assembling a packaged part, this alloy must have a lower melting point than the other solders used in the package in order not to damage the device as a whole. For such applications, it is advisable to use the solders based on Sn-Cu, Sn-In, Sn-Sb, Sn-Bi, or Bi-Sn [12][13][14][15][16][17].…”

Section: Introductionmentioning

confidence: 99%

Study of Bond Formation in Ceramic and Composite Materials Ultrasonically Soldered with Bi–Ag–Mg-Type Solder

et al. 2023

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This research aimed to study a Bi–Ag–Mg soldering alloy and the direct soldering of Al2O3 ceramics and Ni–SiC composites. Bi11Ag1Mg solder has a broad melting interval, which mainly depends on the silver and magnesium content. The solder starts to melt at a temperature of 264 °C. Full fusion terminates at a temperature of 380 °C. The microstructure of the solder is formed by a bismuth matrix. The matrix contains segregated silver crystals and an Ag (Mg, Bi) phase. The average tensile strength of solder is 26.7 MPa. The boundary of the Al2O3/Bi11Ag1Mg joint is formed by the reaction of magnesium, which segregates in the vicinity of a boundary with a ceramic substrate. The thickness of the high-Mg reaction layer at the interface with the ceramic material was approximately 2 μm. The bond at the boundary of the Bi11Ag1Mg/Ni–SiC joint was formed due to the high silver content. At the boundary, there were also high contents of Bi and Ni, which suggests that there is a NiBi3 phase. The average shear strength of the combined Al2O3/Ni–SiC joint with Bi11Ag1Mg solder is 27 MPa.

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Characterization of Soldering Alloy Type Bi-Ag-Ti and the Study of Ultrasonic Soldering of Silicon and Copper

Cited by 3 publications

References 27 publications

Microwave Soldering of Low-Resistance Conductive Joints—Technical and Economic Aspects

Microwave Soldering of Low-Resistance Conductive Joints—Technical and Economic Aspects

Characterization of Zn-Mg-Sr Type Soldering Alloy and Study of Ultrasonic Soldering of SiC Ceramics and Cu-SiC Composite

Study of Bond Formation in Ceramic and Composite Materials Ultrasonically Soldered with Bi–Ag–Mg-Type Solder

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