2012
DOI: 10.1016/j.compositesa.2011.12.006
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Wetting and oxidation during ultrasonic soldering of an alumina reinforced aluminum–copper–magnesium (2024 Al) matrix composite

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Cited by 58 publications
(18 citation statements)
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“…Some of the advantages offered on those new Al-base components include: better wear resistance, strength to rupture [1][2][3][4] , modulus 5,6 , thermal stability 7 , among others. The aim of a composite material is to get a spectrum of properties that cannot be obtained by any of the constituent alone.…”
Section: Introductionmentioning
confidence: 99%
See 1 more Smart Citation
“…Some of the advantages offered on those new Al-base components include: better wear resistance, strength to rupture [1][2][3][4] , modulus 5,6 , thermal stability 7 , among others. The aim of a composite material is to get a spectrum of properties that cannot be obtained by any of the constituent alone.…”
Section: Introductionmentioning
confidence: 99%
“…Metal matrix composites (MMC´s) are fabricated by different methods such as: powder metallurgy 10 , spray atomization, co-deposition, plasma spraying, stir casting [1][2][3][4] and squeeze casting 5 , where the processing method has a strong influence on the final properties of the composites (e.g. mechanical, tribological, etc.)…”
Section: Introductionmentioning
confidence: 99%
“…Ultrasonic brazing is an elegant method to join Al-MMCs in air with the physical assistance. Due to the cavitation effect caused by the ultrasonic wave, not only the surface oxides are disrupted but also the wettability is enhanced [3][4][5][6][7][8][9]. However, higher ultrasonic wave energy may aggravate dissolution of the base metal, which leads to degradation of the substrate properties [10].…”
Section: Introductionmentioning
confidence: 99%
“…Therefore, it is necessary to avoid the formation of Mg-Al IMCs by reducing the joining temperature lower than the Mg-Al intermetallic reaction point. Compared with those methods above, brazing or soldering has many advantages in joining Mg-Al, due to its variable solders and bonding temperature selection [12][13][14]. Wang et al [15] has designed a series of Sn-xZn solders for joining Mg/Al dissimilar metals.…”
Section: Introductionmentioning
confidence: 99%