The effect of ultrasound on transient liquid phase bonding of SiC reinforced Mg metal matrix composites was investigated based on microstructure evolution, phase composition, SiC particles redistribution, mechanical properties and fracture path of the bonded joint. The results indicate the joint of full solid solution without SiC particles aggregation was obtained by inducing the secondary ultrasonic-assisted holding process at 430 °C for 30 s and the joint shear strength reach to 175.5 MPa (87.5% base material strength). The time needed for the isothermal solidification process was significantly shortened to several second time, which is mainly ascribed to the ultrasonic vibration can squeeze out a large fraction of residual liquid phase and facilitate the atomic diffusion in grain boundary.
A novel ultrasonic-assisted low-temperature soldering was developed to join AZ31B Mg alloy and 6061 Al alloy with a series of Sn-xZn solders. The average maximum shear strength of the joints reaches up to 87.5 MPa at soldering temperature of 300°C under ultrasonic assistance for only 5 s using Sn-20Zn solder. The fracture path propagates completely in the soldering seam. The results indicate that the microjet generated by ultrasonic pressure in liquid solder could strike and splinter the Mg 2 Sn intermetallic compounds into small pieces, which contributes to the enhancement of the joint strength. In addition, the primary Al(Zn) solid solution phase formed during cooling stage could also strengthen the joint due to the prevention of microcracks propagation.Acta Metallurgica Sinica (English Letters) (2019) 32:332-342 https://doi.org/10.1007/s40195-018-0749-x( 012 3456789(). ,-volV) (0123456789().,-volV)
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