Wettability of Solid Oxides by Liquid Pure Metals

Nogi, Kiyoshi; Oishi, Keiichiro; Oginö, Kazuhíde

doi:10.2320/matertrans1989.30.137

Cited by 55 publications

(19 citation statements)

References 23 publications

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“…9, the "suggested" s-T relation (dashed line) and the mean value of reported measurements after Keene 9) are also drawn for comparison. The temperature dependence of the surface tension in the present work is very closer to that after Nogi et al 31) and the mean value of reported measurements after Keene than the "suggested" relation after Keene. Keene considered that the major error source in the surface tension measurements is the adsorption of surface active elements such as oxygen and sulfur on the surface of liquid metals, so that he decided the "suggested" relation based only upon the reported data having higher surface tensions.…”

Section: Surface Tension Of Liquid Agsupporting

confidence: 91%

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Improvements in Surface Tension Measurements of Liquid Metals Having Low Capillary Constants by the Constrained Drop Method

et al. 2004

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Accurate measurements of surface tension of liquid metals having low capillary constants (the ratio between density (r) and surface tension (s), r/s) have been attempted using the constrained drop method. High accuracy of surface tension measurements was obtained by making a large axi-symmetric liquid drop and adopting a developed image capturing system composed of a high-resolution charge-coupled device (CCD) camera, an additional CCD camera to adjust the level of the metal drop and a He-Ne laser.

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Section: Surface Tension Of Liquid Agsupporting

confidence: 91%

“…Solid circles and open circles are measurements of the present work using the constrained drop and the traditional sessile drop methods, respectively. Both data are within the scatter of reported values (solid lines 9,[27][28][29][30][31][32][33][34][35][36][37] in Fig. 8: Every data referred in this contribution (Figs.…”

Section: Surface Tension Of Liquid Agsupporting

confidence: 81%

Improvements in Surface Tension Measurements of Liquid Metals Having Low Capillary Constants by the Constrained Drop Method

et al. 2004

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“…Most studies of the wetting behavior of "pure" copper on alumina or sapphire indicate obtuse contact angles varying between 110° and 170° [20,22,55,[58][59][60][61][62][63][64], with more limited evidence suggesting that the contact angle decreases slightly with increasing temperature [59,62,63]. The copper-oxygen phase 8 Morozumi et al [27] report ≈50% bonded area after 1 h, 8.8 MPa, hv bonding at 1600°C.…”

Section: Brazing Using Copper-cuprous Oxide Eutectic and Joint Propermentioning

confidence: 99%

Joining of alumina via copper/niobium/copper interlayers

et al. 2000

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Alumina has been joined at 1150°C and 1400°C using multilayer copper/niobium/copper interlayers. Four-point bend strengths are sensitive to processing temperature, bonding pressure, and furnace environment (ambient oxygen partial pressure). Under optimum conditions, joints with reproducibly high room temperature strengths (≈240 ± 20 MPa) can be produced; most failures occur within the ceramic. Joints made with sapphire show that during bonding an initially continuous copper film undergoes a morphological instability, resulting in the formation of isolated copper-rich droplets/particles at the sapphire/interlayer interface, and extensive regions of direct bonding between sapphire and niobium. For optimized alumina bonds, bend tests at 800°C-1100°C indicate significant strength is retained; even at the highest test temperature, ceramic failure is observed. Postbonding anneals at 1000°C in vacuum or in gettered argon were used to assess joint stability and to probe the effect of ambient oxygen partial pressure on joint characteristics. Annealing in vacuum for up to 200 h causes no significant decrease in room temperature bend strength or change in fracture path. With increasing anneal time in a lower oxygen partial pressure environment, the fracture strength decreases only slightly, but the fracture path shifts from the ceramic to the interface. Cu/Nb/Cu Interlayers R. A. Marks et al. Joining of Alumina via

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“…1, reported measurements are also drawn for comparison. 16,[18][19][20][21][22][23][24][25][26][27][28][29][30] Keene 30) asserted in his review that the surface tension of liquid metal measured using the sessile drop method could be lowly estimated due to the contamination from the substrates (mainly oxides), and the surface tension measured by the levitation method usually showed higher surface tension values than that by the sessile drop method because the sample in the levitation method might not be contaminated from the substrate. However, Egry et al 29) showed that the surface tension of liquid metal droplets measured by the levitation method had been highly estimated due to the electromagnetic pressure on the liquid metal.…”

Section: Surface Tension Of Pure Liquid Ag Cu and Snmentioning

confidence: 99%

Surface Tension and its Temperature Coefficient of Liquid Sn-X (X=Ag, Cu) Alloys

2004

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The surface tension of liquid Sn-X (X=Ag, Cu) alloys was measured by the constrained drop method in the temperatures between 700 and 1500 K across whole composition range. Surface tension of the alloys increased with the content of Ag and Cu, and the temperature coefficient of the surface tension (d'=dT) had both positive and negative values. Experimental results were compared with the calculated results based on Butler's model. The calculated results reasonably accorded with the measurements. The effect of thermo-physical parameters on the surface tension and the temperature coefficient were examined using the model. It was found that the temperature coefficient increases as the difference in the surface tension of component metals or the excess free energy increases in the high composition range of the component metal having higher surface tension, because of the surface enhancement of the other component metal.

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Wettability of Solid Oxides by Liquid Pure Metals

Cited by 55 publications

References 23 publications

Improvements in Surface Tension Measurements of Liquid Metals Having Low Capillary Constants by the Constrained Drop Method

Improvements in Surface Tension Measurements of Liquid Metals Having Low Capillary Constants by the Constrained Drop Method

Joining of alumina via copper/niobium/copper interlayers

Surface Tension and its Temperature Coefficient of Liquid Sn-X (X=Ag, Cu) Alloys

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