Wear of single crystal silicon as a function of surface roughness

Gatzen, H.H.; Beck, Michael Edmund

doi:10.1016/s0043-1648(03)00245-x

Cited by 17 publications

(4 citation statements)

References 5 publications

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“…Therefore, this work also characterizes wear in the processed PDMS films. Silicon by itself does not provide sufficient resistance to wear [11,14], and this is a significant obstacle in further development of MEMS applications that require contact [15,16]. In addition to surface erosion and debris produced during contact, the coefficient of friction (COF) of silicon interfaces changes with the number of wear cycles [11] which can lead to unpredictable performance of the mechanisms.…”

Section: Introductionmentioning

confidence: 99%

Friction, adhesion and wear properties of PDMS films on silicon sidewalls

Penskiy

Gerratt

Bergbreiter

2011

J. Micromech. Microeng.

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This paper demonstrates the first tests of friction, adhesion and wear properties of thin poly(dimethylsiloxane) (PDMS) films on the sidewalls of silicon-on-insulator structures. The test devices were individually calibrated using a simple method that included optical and electrical measurements. The static coefficient of friction versus normal pressure curves were obtained for PDMS-PDMS, PDMS-silicon and silicon-silicon sidewall interfaces. The effects of aging on friction and adhesion properties of PDMS were also evaluated. The results of friction tests showed that the static coefficient of friction follows the JKR contact model, which means that the friction force depends on the apparent area of contact. The wear tests showed high resistance of PDMS to abrasion over millions of cycles.

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Section: Introductionmentioning

confidence: 99%

Friction, adhesion and wear properties of PDMS films on silicon sidewalls

Penskiy

Gerratt

Bergbreiter

2011

J. Micromech. Microeng.

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“…( 12). The SEM investigation by Gatzen aand Beck [9] indicated that the wear debris is S i O 2 during wear process of silicon wafer. Therefore, the third particle of S i O 2 was used in this analysis of the polishing process.…”

Section: Materials Science Forum Vols 505-507mentioning

confidence: 99%

Three-Body Microcontact Model of Rough Surfaces and Its Application on Polishing of Wafer

Horng

Lee

2006

MSF

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In this study, a three-body microcontact model for rough surfaces is proposed in order to understand the effects of particles between surfaces on contact characteristics and its application on polishing of wafer. Both transitional surface-to-surface and particle-to-surface two-body microcontact simulations can be obtained according to the simplification of this model. In the three-body contact situation, the curves of contact area ratio versus dimensionless load are located in the range between two straight lines. The surface-to-surface two-body contact situation is the upper bound and the particle-to-surface two-body contact situation is the lower bound. As the value of D/σ increases, the contact situation will approach the pure particle-to- surface 2-body contact situation. The model also is used to study the wear mechanisms of the silicon wafer.

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“…13,14 Inuential factors impacting silicone rubber friction encompass stiffness, surface roughness, sliding speed, and contact area. [15][16][17] The mechanical strength of silicone rubber signicantly inuences the contact area, while the utilization of lubricants serves to mitigate the frictional interaction between the rubber and the substrate. 18 Johnson et al conducted an extensive investigation into the friction and wear mechanisms of silicone rubber.…”

Section: Introductionmentioning

confidence: 99%