Wear of silicon surfaces in MEMS

Ku, I.S.Y.; Reddyhoff, Tom; Holmes, Andrew S.; Spikes, H.A.

doi:10.1016/j.wear.2011.04.005

Cited by 67 publications

(49 citation statements)

References 19 publications

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“…A stiffness shift cannot be generated by expanding or shrinking the structural dimensions of a fabricated beam but can be induced by the deformation of beams, such nonlinearity, sticking or defects [6], [18], [19]. However, the nonlinearity is not the contributor to the mentioned abnormal behavior because the changed slope exhibits a good linearity and the sticking can be easily excluded by the movability of mass block in both direction and the return of stiffness to normal state after decreasing acceleration.…”

Section: Analysis and Derivationmentioning

confidence: 99%

Sensitivity Jump of Micro Accelerometer Induced by Micro-fabrication Defects of Micro Folded Beams

Zhou

Chen

et al. 2016

Measurement Science Review

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The abnormal phenomenon occurring in sensor calibration is an obstacle to product development but a useful guideline to product improvement. The sensitivity jump of micro accelerometers in the calibrating process is recognized as an important abnormal behavior and investigated in this paper. The characteristics of jumping output in the centrifuge test are theoretically and experimentally analyzed and their underlying mechanism is found to be related to the varied stiffness of supporting beam induced by the convex defect on it. The convex defect is normally formed by the lithography deviation and/or etching error and can result in a jumping stiffness of folded microbeams and further influence the sensitivity when a part of the bending beams is stopped from moving by two surfaces contacting. The jumping level depends on the location of convex and has nothing to do with the contacting properties of beam and defects. Then the location of defect is predicted by theoretical model and simulation and verified by the observation of micro structures under microscopy.The results indicate that the tested micro accelerometer has its defect on the beam with a distance of about 290μm from the border of proof mass block.

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Section: Analysis and Derivationmentioning

confidence: 99%

Sensitivity Jump of Micro Accelerometer Induced by Micro-fabrication Defects of Micro Folded Beams

Zhou

Chen

et al. 2016

Measurement Science Review

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“…Some of the applications of MEMS are motion sensing, optical switching, mechanical actuators [43,47,48], chemical sensors [43,48], and photonic applications [43,49]. Adhesion, friction and wear at the nanometer size scale become critical and can be detrimental to the efficiency, power output and reliability of MEMS devices [50,51]. Al 2 O 3 atomic layer deposition with 10 nm thickness in MEMS devices application has been applied on the wear resistant films of the surfacemicromachined (SMM) devices [20,43,52].…”

Section: Ald For Nanotechnology Application a Mems Devicesmentioning

confidence: 99%

A Review of Atomic Layer Deposition for Nanoscale Devices

Riyanto

Rijanto

Prawara

2012

J. Mechatron. Electr. Power Veh. Technol.

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Atomic layer deposition (ALD) is a thin film growth technique that utilizes alternating, self-saturation chemical reactions between gaseous precursors to achieve a deposited nanoscale layers. It has recently become a subject of great interest for ultrathin film deposition in many various applications such as microelectronics, photovoltaic, dynamic random access memory (DRAM), and microelectromechanic system (MEMS). By using ALD, the conformability and extreme uniformity of layers can be achieved in low temperature process. It facilitates to be deposited onto the surface in many variety substrates that have low melting temperature. Eventually it has advantages on the contribution to the wider nanodevices.Key words: thin coating, atomic layer deposition, nanoscale devices. Abstrak Atomic layer deposition (ALD) adalah teknik penumbuhan lapisan tipis yang menggunakan reaksi kimia jenuh antara gas pendahulu untuk mendapatkan deposisi lapisan skala nano. Teknik ini menjadi subyek yang sangat menarik saat ini untuk deposisi lapisan sangat tipis pada berbagai aplikasi seperti mikroelektronik, photovoltaic, dynamic random access memory (DRAM) dan sistem mikroelektromekanik (MEMS

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“…Microelectromechanical system (MEMS) is a process technology applied to produce smaller devices or systems that combine together the electrical and mechanical components (Ku et al 2011). Silicon wafer is the main material for MEMS, photonics, and semiconductor manufacturing industries (Ku et al 2011;Wadhwa and Kumar 2014;Chen 2006).…”

Section: Introductionmentioning

confidence: 99%

“…Silicon wafer is the main material for MEMS, photonics, and semiconductor manufacturing industries (Ku et al 2011;Wadhwa and Kumar 2014;Chen 2006). Nowadays, laser micromachining is used in the MEMS production to replace the traditional method such as the etching process which takes a longer time to finish the process.…”

Section: Introductionmentioning

confidence: 99%

Micro-drilling of silicon wafer by industrial CO2 laser

Sivarao

Kasim

Ali

et al. 2015

Int J Mech Mater Eng

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Background: Laser micromachining is currently used in the MEMS production to replace the traditional etching process which consumes longer time to complete. The objective of this study is to investigate the drilling capability of industrial CO 2 laser in processing of silicon wafer. Methods: In this work, the holes were drilled on P-type silicon wafer with thickness of 525 μm. Geometrical characteristic of holes produce, which is diameter entrance that depends on laser parameter were investigated and analyzed. Analysis of Variance (ANOVA) was used to analyze the result and generated an appropriate model for the laser drilling processing. Results: The laser parameters involved were laser power, pulse frequency and duty cycle. The experimental results showed the entrance diameter of drilling holes was increase when the laser power and duty cycle increased. Conclusion: The entrance diameter of drilling hole decreases when the pulse frequency increases.

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Wear of silicon surfaces in MEMS

Cited by 67 publications

References 19 publications

Sensitivity Jump of Micro Accelerometer Induced by Micro-fabrication Defects of Micro Folded Beams

Sensitivity Jump of Micro Accelerometer Induced by Micro-fabrication Defects of Micro Folded Beams

A Review of Atomic Layer Deposition for Nanoscale Devices

Micro-drilling of silicon wafer by industrial CO2 laser

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