Weak beam studies of dislocation/dispersoid interaction in an ods superalloy

Schröder, Johannes Horst; Arzt, Eduard

doi:10.1016/0036-9748(85)90022-5

Cited by 139 publications

(20 citation statements)

References 9 publications

Supporting

Mentioning

Contrasting

Unclassified

Order By: Relevance

“…The attachment configurations were reported for other materials containing dispersion particles [73,74,75]. In particular, the configuration in Figure 8(b) shows a group of essentially parallel dislocations.…”

Section: Discussionsupporting

confidence: 62%

Micrograin Superplasticity: Characteristics and Utilization

Mohamed

2011

Materials

View full text Add to dashboard Cite

Micrograin Superplasticity refers to the ability of fine-grained materials (1 µm < d < 10 μm, where d is the grain size) to exhibit extensive neck-free elongations during deformation at elevated temperatures. Over the past three decades, good progress has been made in rationalizing this phenomenon. The present paper provides a brief review on this progress in several areas that have been related to: (a) the mechanical characteristics of micrograin superplasticity and their origin; (b) the effect of impurity content and type on deformation behavior, boundary sliding, and cavitation during superplastic deformation; (c) the formation of cavity stringers; (d) dislocation activities and role during superplastic flow; and (e) the utilization of superplasticity.

show abstract

Section: Discussionsupporting

confidence: 62%

Micrograin Superplasticity: Characteristics and Utilization

Mohamed

2011

Materials

View full text Add to dashboard Cite

show abstract

“…A fourth mechanism has been observed experimentally that elucidates the secondary interactions of the dislocation with the particles after the dislocation has surmounted the particle. [70][71][72] Initially, the dislocation line length in close proximity to the particle-matrix interface undergoes climb, while the portion not in contact with the particle remains in the glide plane. It is suggested that the particles have interfaces that may slip and can attract dislocations by reducing the total elastic strain energy.…”

Section: B Creep Behavior Of Solder/cu Jointmentioning

confidence: 99%

Microstructure Characterization and Creep Behavior of Pb-Free Sn-Rich Solder Alloys: Part II. Creep Behavior of Bulk Solder and Solder/Copper Joints

Sidhu

Deng

Chawla

2007

Metall Mater Trans A

View full text Add to dashboard Cite

Microstructure plays a critical role in the mechanical behavior of Sn-rich solder alloys. A unified mechanistic understanding of creep in Sn-rich solder alloys, at various microstructural length scales, is missing. Part I of this study focused on microstructure characterization of Sn-rich solder alloys. Part II focuses on the creep behavior of bulk solder alloys and small solder joints comparable in size and geometry to those in electronic packages. Pure Sn, Sn-0.7Cu, Sn-3.5Ag, and Sn-3.9Ag-0.7Cu were used in these studies. At the bulk level, creep appears to be controlled by subgrain formation, whose size is controlled by Ag 3 Sn orCu 6 Sn 5 particles. At the smaller joint level, where the microstructures are much finer, creep in Ag-containing alloys was controlled by local climb and detachment along Ag 3 Sn particles. The threshold stress for creep is inversely proportional to the Ag 3 Sn interparticle spacing. At the joint level, the creep of Sn and Sn-Cu alloys was controlled by viscous flow at grain boundaries at low stress, and transition to dislocation climb at higher stress.

show abstract

“…However, these theories cannot provide a satisfactory explanation for the creep of dispersion strengthened (DS) alloys in terms of a threshold stress. It has been proposed that the dislocation-particle attachment is actually a lower-energy configuration [49][50][51][52][53] than that in which the dislocation and the particle are not in contact. Arzt and Wilkinson [51] developed a model in which the dislocations are assigned a lower energy near the particle.…”

Section: Dispersion/dislocation Interactions During High-temperature mentioning

confidence: 99%

Processing and microstructural evolution of powder metallurgy Zn-22 Pct Al eutectoid alloy containing nanoscale dispersion particles

Xun¹,

Rodriguez²,

Lavernia

et al. 2005

Metall Mater Trans A

View full text Add to dashboard Cite

The present article deals with the processing and microstructural evolution of powder metallurgy (PM) Zn-22Al pct eutectoid alloy. The powder material was produced through inert gas atomization and then cryomilled in liquid nitrogen. The milled powder particles were consolidated by hot isostatic pressing ("hipping") followed by thermomechanical treatment, resulting in a two-phase microstructure. The microstructures were characterized using scanning electron microscopy (SEM) and transmission electron microscopy (TEM). The principal processing factors and microstructural characteristics associated with the major processing steps, including spray atomization, mechanical milling (MM), consolidation, and heat treatment, were evaluated and discussed. Hot isostatic pressing and extrusion followed by heat treatment to produce the superplastic structure (Al-rich phase and Zn-rich phase) are effective in elimination porosity. A TEM examination of the microstructure of the alloy after processing reveals the presence of nanodispersion particles that are not uniformly distributed. The formation of the dispersions was attributed to the interaction between the powder material (primarily Al phase) and environmental elements such as oxygen and nitrogen during milling. Moreover, the size and distribution of the dispersions present in the bulk material met the anticipated requirements for serving as inhibitors for grain growth and barriers for dislocation movement. The TEM observations on crept specimens reveal extensive dislocation/dispersion interactions.

show abstract

Weak beam studies of dislocation/dispersoid interaction in an ods superalloy

Cited by 139 publications

References 9 publications

Micrograin Superplasticity: Characteristics and Utilization

Micrograin Superplasticity: Characteristics and Utilization

Microstructure Characterization and Creep Behavior of Pb-Free Sn-Rich Solder Alloys: Part II. Creep Behavior of Bulk Solder and Solder/Copper Joints

Processing and microstructural evolution of powder metallurgy Zn-22 Pct Al eutectoid alloy containing nanoscale dispersion particles

Contact Info

Product

Resources

About