Water glass bonding for micro-total analysis system

Ito, Takeshi; Sobue, Kazuharu; Ohya, Seishiro

doi:10.1016/s0925-4005(01)00951-0

Cited by 35 publications

(16 citation statements)

References 9 publications

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“…Two working electrodes made of Au thin film were arranged face to face position as the center of the electrodes were conformed. All the electrodes were fabricated by lithography technique and vaccum deposition [27]. The thickness of all the thin electrodes were set to about 200 nm, and the Cr thin layers (about 20 nm) were deposited as a buffer layer to tightly bond electrode layers on the glass wafer.…”

Section: Structure and Fabrication Of The Chipmentioning

confidence: 99%

Electrochemical Behavior of Parallel Opposed Dual Electrode in a Microchannel

Ito¹,

Maruyama²,

Sobue³

et al. 2004

Electroanalysis

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The electrochemical behavior dependent on the microchannel depth is discussed using a parallel opposed dual electrode in the microchip. The microchannel depth was controlled easily by the thickness of the photoresist. Cyclic voltammetry (CV) was carried out with conventional mode and the generation-collection mode. High collection efficiency (max: 98%) and high current amplification (max: 5.2) were achieved without miniaturizing the dual electrode by micromachining techniques, when the microchip with the microchannel depth of 30 mm was used in the generation-collection mode at low sweep rates. Quantitative analysis was applied to electrochemically reversible species with a quicker response time of around a few seconds for the same microchannel depth on chronoamperometry (CA). We observed good linearity on the calibration plot of dopamine (2 Â 10 À6 -ca. 1 Â 10 À3 mol dm À3 ).

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Section: Structure and Fabrication Of The Chipmentioning

confidence: 99%

Electrochemical Behavior of Parallel Opposed Dual Electrode in a Microchannel

Ito¹,

Maruyama²,

Sobue³

et al. 2004

Electroanalysis

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“…Tests of adhesion are essentially fracture tests and several possible tests can be performed qualitatively (peel test) [7] or quantitatively ((normal, peninsular, "inverted") blister tests [6][7][8][9][10], tensile test [11,12], three-point bending test [13], and razor blade test [14].) As mentioned earlier, the amount of bond strength or adhesiveness was characterized by a manual peel of the passivated silicon from the underlying PDMS layer and through a mechanical shear test.…”

Section: Bond Strength Testmentioning

confidence: 99%

Evaluation of bonding between oxygen plasma treated polydimethyl siloxane and passivated silicon

Tang

Liao

Ong

et al. 2006

J. Phys.: Conf. Ser.

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“…The channels were sealed with a thin microscope glass cover slide serving as bottom plate. The cover slide was bonded by means of a low-temperature bonding technique, which gives a very robust bonding [36]. This technique relies on the deposition of an inorganic silica (water glass) solution between the two glass plates, requiring only about 1007C annealing temperature and no pressure.…”

Section: Microfabricationmentioning

confidence: 99%

A simple mechanism for reliable particle sorting in a microdevice with combined electroosmotic and pressure‐driven flow

Johann

Renaud

2004

Electrophoresis

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Selective transport and sorting of particles in microfluidic devices by electroosmosis is complicated due to superposition of uncontrolled hydrodynamic pressure contributions on the electroosmotic force. In this paper, we present a microfluidic concept for the reliable and simple separation and sorting of particles in a microchip by electroosmosis combined with pressure-driven flow. The presented device allows fluid quantities to be switched and particles to be sorted within a channel manifold using only a single power supply with fixed voltage and an electric switch. Consequently, chip operation and fluid switching procedure are greatly simplified compared to a situation, in which several independent power sources are used for flow balancing, as is the common procedure. With the triple-T channel design presented, backpressure flow disturbing the electrokinetic fluid and particle separation process is eliminated by introducing controlled opposed hydrodynamic flow of buffer from side channels. This pressure-driven flow is generated on-chip by setting up differences in the reservoir pressures in a defined manner. A detailed flow analysis based on the equivalence of fluid flow and electric current is performed and the conditions for reliable chip function are worked out.

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Water glass bonding for micro-total analysis system

Cited by 35 publications

References 9 publications

Electrochemical Behavior of Parallel Opposed Dual Electrode in a Microchannel

Electrochemical Behavior of Parallel Opposed Dual Electrode in a Microchannel

Evaluation of bonding between oxygen plasma treated polydimethyl siloxane and passivated silicon

A simple mechanism for reliable particle sorting in a microdevice with combined electroosmotic and pressure‐driven flow

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