Warpage Study of Ultra Thin Package Used in Mobile Devices

Song, Cha-Gyu; Kim, Kyoung-Ho; Choa, Sung‐Hoon

doi:10.5781/kwjs.2011.29.1.020

Journal of the Korean Welding and Joining Society

2011

DOI: 10.5781/kwjs.2011.29.1.020

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Warpage Study of Ultra Thin Package Used in Mobile Devices

Cha-Gyu Song¹,

Kyoung-Ho Kim²,

Sung‐Hoon Choa³

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2014

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Cited by 1 publication

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Wafer Level Package Design Optimization Using FEM

Ko¹,

Lim²,

Kim³

et al. 2014

Journal of the Korean Society of Manufacturing Technology Engin

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ARTICLE INFO ABSTRACTArticle history:Wafer level package technology is added to the surface of wafer circuit packages to create a semiconductor technology that can minimize the size of the package. However, in conventional packaging, warpage and fracture are major concerns for semiconductor manufacturing. We optimized the wafer dam design using a finite element method according to the dam height and heat distribution thermal properties. The dam design influences the uniform deposition of the image sensor and prevents the filling material from overflowing. In this study, finite element analysis was employed to determine the key factors that may affect the reliability performance of the dam package. Three-dimensional finite element models were constructed using the simulation software ANSYS to perform the dam thermo-mechanical simulation and analysis.

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Wafer Level Package Design Optimization Using FEM

Ko¹,

Lim²,

Kim³

et al. 2014

Journal of the Korean Society of Manufacturing Technology Engin

View full text Add to dashboard Cite

show abstract

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Warpage Study of Ultra Thin Package Used in Mobile Devices

Cited by 1 publication

References 6 publications

Wafer Level Package Design Optimization Using FEM

Wafer Level Package Design Optimization Using FEM

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