Warpage of InP wafers

Fukui, Tsutomu; Kurita, H.; Makino, Nobuo

doi:10.1109/iciprm.1997.600121

Cited by 4 publications

(3 citation statements)

References 0 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…A typical closed-loop controller is of the proportional-integral-derivative type given as (13) Substituting (13) into (12) gives (14) where Rewriting (14) gives (15) where , , are the roots of (16) (12) Equation (15) can be solved to give (17) As shown in Fig. 3, the bakeplate temperature dropped to a minimum point before recovering.…”

Section: Thermal Modelingmentioning

confidence: 99%

See 1 more Smart Citation

In Situ Fault Detection of Wafer Warpage in Microlithography

Tay

Zhou

et al. 2004

IEEE Trans. Semicond. Manufact.

View full text Add to dashboard Cite

Wafer warpage is common in microelectronics processing. Warped wafers can affect device performance, reliability and linewidth control in various processing steps. We proposed in this paper an in situ fault detection technique for wafer warpage in microlithography. Early detection will minimize cost and processing time. Based on first principle thermal modeling, we are able to detect warpage fault from available temperature measurements. Experimental results demonstrate the feasibility and repeatability of the approach. The proposed approach is applicable to other semiconductor substrates.

show abstract

Section: Thermal Modelingmentioning

confidence: 99%

“…There are a few stress factors that account for wafer warpage or bow during its processing [13]: 1) Stress from mechanical processing of the wafer surface, e.g. chemical mechanical polishing or backgrinding, causes it to bend or fracture.…”

Section: In Situ Fault Detection Of Wafermentioning

confidence: 99%

In Situ Fault Detection of Wafer Warpage in Microlithography

Tay

Zhou

et al. 2004

IEEE Trans. Semicond. Manufact.

View full text Add to dashboard Cite

show abstract

“…Gettering and dislocation density in silicon wafers also affect wafer warpages; Kishino et al [2] reported a warpage range from 40 to 120 µm for a change of 1000 cm −3 in dislocation density. Fukui and Kurita [3] reported that warpage of up to 60 µm is induced during the processing of InP wafers. Warpage can also affect device performance, reliability and linewidth or critical dimension (CD) control in various microlithographic patterning steps.…”

Section: Introductionmentioning

confidence: 99%

A fastin situapproach to estimating wafer warpage profile during thermal processing in microlithography

Hu¹,

Tay²,

Tsai³

2006

Meas. Sci. Technol.

View full text Add to dashboard Cite

Wafer warpage can affect device performance, reliability and linewidth control in various processing steps in microelectronics manufacturing. Early detection will minimize cost and processing time. We have previously demonstrated an on-line approach for detecting wafer warpage and the profile of the warped wafer. The proposed approach demonstrates that the profile of the wafer can be computed during thermal processing steps in the lithography sequence. However, the approach is computationally intensive and information is made available at the end of the thermal processing step. Any attempts at real-time correction of the wafer temperature are thus not possible. In this paper, we proposed an in situ approach to detect wafer warpage and its profile midway through the thermal process. Based on first principles thermal modelling, we are able to detect and estimate the profile of a warped wafer from available temperature measurements. The proposed approach can be implemented on conventional thermal processing systems. Experimental results demonstrate the feasibility and repeatability of the approach. A 75% improvement in computational time is achieved with the proposed approach.

show abstract

Detection of wafer warpages during thermal processing in microlithography

Tay

Zhou³

et al.

ICARCV 2004 8th Control, Automation, Robotics and Vision Conference, 2004.

View full text Add to dashboard Cite

Warpage of InP wafers

Cited by 4 publications

References 0 publications

In Situ Fault Detection of Wafer Warpage in Microlithography

In Situ Fault Detection of Wafer Warpage in Microlithography

A fastin situapproach to estimating wafer warpage profile during thermal processing in microlithography

Detection of wafer warpages during thermal processing in microlithography

Contact Info

Product

Resources

About