2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems &Amp; Eurosensors XXXIII (TRANSDUCERS &Am 2019
DOI: 10.1109/transducers.2019.8808559
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Wafer-Scale Self-Aligned Fabrication of Nanometric Curved Tunneling Junctions

Abstract: This paper introduces a new self-aligned procedure for wafer-scale fabrication of curved metal-insulatorsemiconductor (cMIS) tunneling junctions with nanometric lateral dimensions. The fabrication process is based on the use of an array of silicon nano-pillars embedded in a silicon nitride membrane. The junctions are formed at the apex of pyramidal pits and the tunneling window is defined using self-aligned corner lithography. The current densities of the functional cMIS-junctions with a 2.5 nm thick tunneling… Show more

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Cited by 1 publication
(3 citation statements)
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“…In this paragraph, we discuss the effects of varying the process settings and the RIE plasma conditions upon etching SiNWs. The initial process recipe was optimised for etching straight SiNWs of ~250 nm in height after 60 s of etching SiNWs under a full-wafer-scale DTL fabricated PFI+BARC mask [4]. Considering a 100 mm diameter substrate, and 250 nm wide square unit cell containing the PFI+BARC columns, the silicon loading to which the process was initially optimised was ~87%.…”
Section: Rie Of Silicon In An Sf 6 ; C 4 F 8 Plasmamentioning
confidence: 99%
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“…In this paragraph, we discuss the effects of varying the process settings and the RIE plasma conditions upon etching SiNWs. The initial process recipe was optimised for etching straight SiNWs of ~250 nm in height after 60 s of etching SiNWs under a full-wafer-scale DTL fabricated PFI+BARC mask [4]. Considering a 100 mm diameter substrate, and 250 nm wide square unit cell containing the PFI+BARC columns, the silicon loading to which the process was initially optimised was ~87%.…”
Section: Rie Of Silicon In An Sf 6 ; C 4 F 8 Plasmamentioning
confidence: 99%
“…The effect of the smaller loading is immediately apparent; an extensive amount of barrelling is observed yielding thin SiNWs. The initial full wafer-scale recipe, [4], performs well on the full wafer-scale and is used for the etching of the SiNWs in the case of the fabrication of massively parallel EOF pump, with 50 sccm C 4 F 8 flow, but etches too fast on the hybrid mask substrate. Subsequently, the SF 6 flow was reduced with 3 sccm to reduce the etch-rate, run 1.2 in Table 2.…”
Section: Rie Of Silicon In An Sf 6 ; C 4 F 8 Plasmamentioning
confidence: 99%
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