2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS) 2014
DOI: 10.1109/memsys.2014.6765700
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Wafer scale fabrication of highly integrated rubidium vapor cells

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Cited by 18 publications
(10 citation statements)
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“…Another method applies the use of the physical deposition process to deposit a layer of alkali azide [45,57,58,59,60] or pipetting of water solution of alkali azide [61,62,63] on the inner side of the cell window. Compound decomposition is induced by exposing encapsulated cells to ultraviolet (UV) radiation.…”
Section: Methods Of Mems Vapor Cell Fabricationmentioning
confidence: 99%
“…Another method applies the use of the physical deposition process to deposit a layer of alkali azide [45,57,58,59,60] or pipetting of water solution of alkali azide [61,62,63] on the inner side of the cell window. Compound decomposition is induced by exposing encapsulated cells to ultraviolet (UV) radiation.…”
Section: Methods Of Mems Vapor Cell Fabricationmentioning
confidence: 99%
“…There is a constant development of new paradigms, one recent example we have discussed above is electric field sensors based on EIT with warm Rydberg atoms [117,141]. Such developments are accompanied by technological maturation of miniature-cell fabrication [26,[142][143][144], which provides more robust, versatile, and compact platforms for EIT utilization. In parallel to academic research, the technology is also developed in the industry, in both large and small companies.…”
Section: Eit As a Spectral Filtermentioning
confidence: 99%
“…The conventional method is using BaN 6 and RbCl to release the rubidium substance by chemical reaction at high temperature, but the compound is poisonous and a reverse reaction exists [ 38 ]. The improved method is the in-situ ultraviolet decomposition of RbN 3 , while the buffer gas pressure is difficult to be precisely controlled [ 39 , 40 , 41 , 42 ]. Another strategy is to use paraffin to fully cover rubidium in the glove box with MEMS molds and to transport the paraffin-rubidium package to the cell directly, regardless of atmosphere [ 43 ].…”
Section: Vapor Cell Fabricationmentioning
confidence: 99%