Wafer-Level Integration of an Advanced Logic-Memory System Through the Second-Generation CoWoS Technology

Pathfinding for 2.5D interconnect technologies

“…(requires precise die placement and low die edge roughness) [7,12,22] to usually a few millimeters [29]. The first I/O column is placed at a distance from the edge of the die to accommodate dicing channel and sealring.…”

“…Several 2.5D integration technologies have already been commercialized and many others are under active development. Examples include TSMC's CoWoS [9,12], InFO [21], Intel's EMIB [22], Samsung I-Cube [2], Amkor's CoS, CoW, HDFO technologies [19], Silicon Interconnect Fabric (Si-IF) [6,7], etc. These technologies offer minimum bump pitch in the range of 10 -65 , minimum wire pitch in the range of 0.4 -4 , and 2-4 layers of metal routing.…”

Recent Advances and Trends in Fan-Out Wafer/Panel-Level Packaging

“…Because of the drive of AI, ML, and 5 G, the semiconductors such as the sliced field-programmable gate arrays density and I/Os increase and pad-pitch decreases. Even a 12 build-up layers (6-2-6), organic package substrate is not enough to support the sliced chips and a TSV-interposer is needed [121][122][123][124][125][126][127][128][129][130][131][132][133][134][135][136][137][138][139]. TSMC called this kind of structure CoWoS (chip-on-wafer-on substrate) [137,138].…”

“…Leti [121,122] called it SoW (system-on-wafer). Figure 35 schematically [123] shows an advanced packaging of a SoC (system-of-chip) such as the central processor unit (CPU) or graphic processor unit (GPU) and HBMs, which consist of a stack of DRAMs and a base logic vertically interconnect through TSVs and microbumps. These SoC and HBMs are side-by-side attached through microbumps on a TSV-interposer with RDLs.…”

Preparation and Characterization of Sprayed-Yttrium Oxyfluoride Corrosion Protective Coating for Plasma Process Chambers

“…Integrated circuit (IC) technology incorporates various features on single electrical chips [1]. The increasing miniaturization of modern ICs has promoted the use of high-density plasma irradiation for silicon wafer processing.…”