Voltammetric behaviour of the copper(II)—thiourea system in sulphuric acid medium at platinum and glassy carbon electrodes

Cofre, Pablo; Bustos, Alex

doi:10.1007/bf00249859

Cited by 32 publications

(21 citation statements)

References 8 publications

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“…Thiourea [6][7][8][9][10][11][12][13][14][15] has been used commercially in copper electrorefining and electrowinning, in order to produce smooth and bright copper deposits. Rogers et al [16] have found that thiourea acts as both leveler and brightener in Watts-type nickel baths.…”

Section: Introductionmentioning

confidence: 99%

Effect of thiourea during nickel electrodeposition from acidic sulfate solutions

Mohanty

Tripathy

Das

et al. 2005

Metall Mater Trans B

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The effect of thiourea on the cathodic current efficiency (CE), deposit quality, crystallographic orientations, surface morphology, and polarization behavior of the cathode was investigated during nickel electrodeposition from acidic sulfate solutions for 2 hours at 60 °C. A slight decrease of 3 to 4 pct in the CE was observed, when the concentration of thiourea was increased from 2 to 40 mg dm Ϫ3 . The nickel deposit quality deteriorated significantly at higher thiourea concentrations; the surface morphology deteriorated and the contamination of the nickel deposits increased. The presence of thiourea affected the peak intensities of the crystal planes. Cyclic voltammetric studies on nickel deposition at 25 °C revealed depolarization behavior of the cathode at lower thiourea concentrations, Յ10 mg dm Ϫ3 ; however, a mixed behavior is observed at higher thiourea concentrations. These changes were also observed in the exchange current density (i 0 ) values.

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Section: Introductionmentioning

confidence: 99%

Effect of thiourea during nickel electrodeposition from acidic sulfate solutions

Mohanty

Tripathy

Das

et al. 2005

Metall Mater Trans B

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“…Appropriate amounts of additives are necessary for the formation of ine-grained, smooth and compact deposits. Additives, such as thiourea [69][70][71], gelatine [72,73] and animal glue [74], are commonly used as levelling and brightening agents in copper electrodeposition and electrowinning in order to produce smooth, free of voids and porosity copper deposits. Although advances have been made, in many cases the use of these additives is still carried out in an empirical way, and there are still many unknown aspects concerning the mechanism of action of additives.…”

Section: Additives For Copper Electrodepositionmentioning

confidence: 99%

Ionic Liquids as Electrodeposition Additives and Corrosion Inhibitors

Zhang¹,

Ye²

2017

Progress and Developments in Ionic Liquids

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Ionic liquids (ILs) are molten salts with a melting point of 100°C or below and solely consist of cations and anions. As a kind of novel green solvent, ILs have been obtained broad and deep investigations, and enormous progresses in various ields have been made during the recent 20 years. Despite the fact that the application studies of ILs have been proposed in various ields, no processes have yet been developed to an industrial scale. However, the main interests are still focused on their industrial applications. In this chapter, two perspective applications of ILs in electrochemical ields including additives for metal electrodeposition and inhibitors for metal anti-corrosion were introduced.

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“…특히, thiourea는 주로 Cu 도금층의 광 택도와 평탄도를 제고시킬 목적으로 현장에서 광범 위하게 적용되고 있는 유기 화합물로써, 도금 용액 중의 Cu(II) 및 Cu(I) 이온과 안정한 착화합물을 형 성하여, 전극 표면에 흡착됨으로써 Cu adion의 표 면 확산을 저해하는 것으로 알려져 있다 6) . 본 연구에서는 전기 도금법에 의한 대면적 박막 도금 균일성 확보와 도금 형상의 고정밀화를 목적 으로 도금액 내에서 Thiourea(TU) 유기물 첨가제의 전기화학적 거동과 표면 특성에 미치는 효과를 다 양한 전기화학적인 기법으로써 관찰하였다.…”

Section: 서 론unclassified

Effect of Thiourea on the Copper Electrodeposition

Lee¹,

Yim²,

Hwang³

et al. 2010

Journal of the Korean institute of surface engineering

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The effect of organic additives, thiourea (TU), on the copper electroplated layer of large rectangular size was investigated through physical and various electrochemical techniques. It was found that TU had strong adsorption characteristics on the Ni substrate and affected the initial electroplating process by inducing surface reaction instead of mass transfer in the bulk solution. TU additives had its critical micelle concentration at 200 ppm in copper sulphate solution and showed abrupt change in morphological and electrochemical impedance spectroscopic results around this concentration, which could be related with the destruction of adsorption structure of TU-Cu(I) complex formed at the Ni substrate surface. By conducting a commercial electroplating simulation, when TU additives was included at cmc in the plating solution, it acted as a depolarizer for copper electrodeposition and was effective to reduce the unevenness of copper deposits between centre and edge region at high current densities of 10 ASD.

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Voltammetric behaviour of the copper(II)—thiourea system in sulphuric acid medium at platinum and glassy carbon electrodes

Cited by 32 publications

References 8 publications

Effect of thiourea during nickel electrodeposition from acidic sulfate solutions

Effect of thiourea during nickel electrodeposition from acidic sulfate solutions

Ionic Liquids as Electrodeposition Additives and Corrosion Inhibitors

Effect of Thiourea on the Copper Electrodeposition

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