2020
DOI: 10.1007/s11664-020-08065-2
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Visualization of Delamination in Encapsulated Flexible Electronics Fabricated using Slot Die Coating

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Cited by 5 publications
(2 citation statements)
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“…As for the spray-coated film, the adhesion was very poor; the whole film delaminated (0B) as shown in Figure g–i. It has been shown experimentally that thicker coatings improve adhesion testing results. Hence, the poor adhesion exhibited by the spray-coated samples is attributed to the film thickness (which is on the order of 1–5 μm) and preexisting deformation of the overall coating. Moreover, the slot die-coated CA film was UV-treated, which is believed to enhance bonding between the fluid and the substrate material as it was drying.…”
Section: Resultsmentioning
confidence: 99%
“…As for the spray-coated film, the adhesion was very poor; the whole film delaminated (0B) as shown in Figure g–i. It has been shown experimentally that thicker coatings improve adhesion testing results. Hence, the poor adhesion exhibited by the spray-coated samples is attributed to the film thickness (which is on the order of 1–5 μm) and preexisting deformation of the overall coating. Moreover, the slot die-coated CA film was UV-treated, which is believed to enhance bonding between the fluid and the substrate material as it was drying.…”
Section: Resultsmentioning
confidence: 99%
“…This non-destructive and intuitive method has multiple forms of measurement and can reveal internal stress. The photoelastic method has been employed to measure full-field stresses in flexible electronic devices, such as the work of Jeong et al, which analyzed the effects of flexible electronic packaging under different tensile strains [8]. Meanwhile, infrared photoelastic techniques have developed rapidly, which have been applied to stress analysis of semiconductor electronic structures such as Through-Silicon Vias [9], microelectromechanical systems [10], and solar silicon wafers [11].…”
Section: Introductionmentioning
confidence: 99%