1997
DOI: 10.1063/1.120456
|View full text |Cite
|
Sign up to set email alerts
|

Visible electroluminescence from Eu:CaF2 layers grown by molecular beam epitaxy on p-Si (100)

Abstract: Visible electroluminescence (EL) is observed at room temperature by current injection into Eu:CaF2 layers containing 7.5 and 8.0 at. % Eu grown by molecular beam epitaxy on lightly doped (100) p-type silicon. The EL spectra are broad with peaks near 700 and 600 nm, respectively. Room temperature photoluminescence spectra for the same samples exhibited peaks near 420 nm, with higher doped samples showing a more pronounced long wavelength tail. Although both metal and indium–tin–oxide (ITO) contacts were success… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
1
1

Citation Types

0
12
0

Year Published

1998
1998
2023
2023

Publication Types

Select...
6
1

Relationship

1
6

Authors

Journals

citations
Cited by 12 publications
(12 citation statements)
references
References 11 publications
0
12
0
Order By: Relevance
“…Halpin‐Tsai's approximation was also used to predict the modulus of the prepared composites. This model refers to the tensile behavior of composites that contain randomly oriented fibers and takes into consideration the reinforcement effect derived from the presence of rigid inclusions in the matrix without considering the filler‐filler and filler‐matrix interactions [ 64–69 ] . According to this model, the composites' modulus can be described by the following equation: Ec=Em()1+ξηnormalVnormalf1ηnormalVnormalf where ξ = 2r and r the aspect ratio of the filler particle and η can be calculated from the following expression: normalη=normalEnormalfnormalEnormalm1normalEnormalfnormalEnormalm+normalξ …”
Section: Resultsmentioning
confidence: 99%
“…Halpin‐Tsai's approximation was also used to predict the modulus of the prepared composites. This model refers to the tensile behavior of composites that contain randomly oriented fibers and takes into consideration the reinforcement effect derived from the presence of rigid inclusions in the matrix without considering the filler‐filler and filler‐matrix interactions [ 64–69 ] . According to this model, the composites' modulus can be described by the following equation: Ec=Em()1+ξηnormalVnormalf1ηnormalVnormalf where ξ = 2r and r the aspect ratio of the filler particle and η can be calculated from the following expression: normalη=normalEnormalfnormalEnormalm1normalEnormalfnormalEnormalm+normalξ …”
Section: Resultsmentioning
confidence: 99%
“…͑3͒, ␤ represents the critical exponent describing the growth of the percolation probability near the threshold, while the parameter ␣ controls the width of the transition and x͑L͒ is the dimensionless volume fraction in terms of the percolation threshold for rods of length L. Similar representations of the percolation probability, employing either the value for the exponent ␤ obtained from Monte Carlo simulations in three dimensions 26 ͑␤ = 0.47͒ or the mean-field value 19 ͑␤ =1͒, have been invoked in prior models 6,7 for the elastic properties of networks and composites. In Eq.…”
Section: Elastic Network Model In Three Dimensionsmentioning
confidence: 99%
“…Upper and lower bounds on the moduli of composites are known, which are based solely on information regarding the volume fraction of each component and the properties of these components in their pure states. [6][7][8] A number of effective medium theories treat dispersions of spheroidal inclusions within an otherwise homogeneous matrix using the classical theory of elasticity. [6][7][8] A number of effective medium theories treat dispersions of spheroidal inclusions within an otherwise homogeneous matrix using the classical theory of elasticity.…”
Section: Introductionmentioning
confidence: 99%
See 1 more Smart Citation
“…% Eu. 8 In this article we report studies of morphological features of MBEgrown Eu:CaF 2 /Si͑100͒ layers using atomic force microscopy ͑AFM͒ and the EL emission spectra from EL devices fabricated with this material. Compatibility with standard silicon processing techniques makes this a promising materials system for integration of optical emitters with silicon circuitry.…”
Section: Introductionmentioning
confidence: 99%