Emerging moisture
sensitive devices require robust encapsulation
strategies to inhibit water ingress and prevent premature failure.
A scalable, open-air plasma process has been developed to deposit
alternating layers of conformal organosilicate and dense SiO2 thin-film barriers to prevent moisture ingress. The in situ low-temperature
process is suitable for direct deposition on thermally sensitive devices
and is compatible with flexible polymeric substrates. Using optical
calcium testing, low water vapor transmission rates on the order of
10–3 g/m2/day at an accelerated aging
condition of 38 °C and 90% relative humidity (RH) are achieved.
Using moisture-sensitive perovskite devices as a representative moisture-susceptible
device, devices retain over 80% of their initial performance for over
660 h in a 50 °C 50% RH accelerated aging environment. The ability
of the multilayer barrier to enable device resistance to humid environments
is crucial toward realizing longer operating lifetimes.