where W and L are the channel width and length, respectively, µ sat is the saturation mobility, C i represents the capacitance per unit area of the dielectric layer, and V T is the threshold voltage in OTFT. The µ sat and V T values are closely related to the properties of channel materials and their interfaces. [ 3 ] To increase I DS with a fi xed V G , it is important to make C i high, considering W and L are predetermined factors. The C i of the given dielectric material can be expressed bywhere ε 0 is the permittivity of vacuum, k is the dielectric constant, and d is the thickness of the dielectric layer, respectively. From the Equation ( 2) , it follows that reducing d or increasing k is required for high C i , leading to high I DS . To reduce d , extremely thin dielectric materials such as selfassembled monolayers (SAMs) [ 4 ] and self-assembled nanodielectrics (SANDs) [ 5 ] had been investigated. However, it was not trivial to secure reliable insulating properties of the ultrathin self-assembled layer, since the full coverage of the monolayer dielectric is strongly affected by environmental parameters such as the composition and corrugation of the surface. [ 6 ] Use of polymer electrolyte materials such as ion-gel [ 7 ] had also been attempted as dielectric layers to increase k , thus C i . Although capacitance exceeding 10 µF cm −2 was demonstrated with the ion-gels via suffi cient mobile ions in the electrolyte, low polarization speed, and high gate leakage current ( I G ) hindered the broad use of ion-gel-based gate dielectrics.As far as the gate dielectrics are concerned, polymeric thin fi lms have been considered as ideal candidates, which exhibit a wide range of dielectric constants, [ 8 ] low-temperature processability, mechanical robustness, and cost competitiveness. [ 9 ] However, with only few exceptions, [ 10,11 ] the insulating property of the polymer fi lms degrades severely as the fi lms become thinner. Various crosslinkable polymers including polyimide (PI), [ 12 ] divinyltetramentyldisiloxane-bis-(benzocyclobutene) (BCB), [ 13 ] poly(4-vinylphenol) (PVP), [ 14,15 ] and Cytop [ 10 ] have been suggested to resolve the problem, however, their high crosslinking/curing temperature (generally higher than 200 °C) limits their application to fl exible devices. Also, retaining the device-to-device uniformity of the ultrathin layer while keeping the high insulating property is still challenging.In this regard, to develop ultrathin but highly uniform polymer dielectrics, a vapor-phase initiated chemical vapor deposition (iCVD) is introduced. [ 16 ] The process can deposit various