Vibration Analysis of Wire and Frequency Response in the Modern Wiresaw Manufacturing Process

Wei, Shouyi; Kao, Imin

doi:10.1006/jsvi.1999.2471

Cited by 59 publications

(24 citation statements)

References 13 publications

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“…The increase of wire tension and slurry viscosity decreases vibration amplitude and kerf loss, while the wire speed has almost no affect when it is below 25 m/s. 1,10 Process monitoring of the wire saw for forces, wire speed, feed rate, wire bow, and wire tension was developed by Clark et al. 5 Parametric studies relating process parameters to forces, and surface roughness and wire wear for cutting foam ceramics and wood were conducted by Clark et al.…”

Section: Introductionmentioning

confidence: 99%

Roughness damage evolution due to wire saw process

Teomete

2011

Int. J. Precis. Eng. Manuf.

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The wire saw process is widely used for silicon wafer production with high yield and low surface damage in solar cell and microelectronics industries. The wire saw process is used to machine brittle materials in the ductile regime where high yield and low surface damage are desired. The wire saw process is also used to cut concrete and rocks in civil engineering. In this study, an experimental parametric study was conducted by varying process parameters to determine surface roughness damage. Ductile regime material removal by trans-granular failure and brittle fracture by inter-granular failure are observed in electron micrographs of the cut surfaces. A damage model that relates the roughness damage to process parameters was derived. The damage model predicts the roughness damage satisfactorily. The model shows that the roughness damage is proportional to the ratio of feed speed to wire speed. Improvement in the efficiency of the process without increasing the roughness damage can be attained by increasing the feed speed proportionally to wire speed. Wire tension does not affect roughness damage. Roughness damage, however, is affected by properties of the wire. Wires having smaller grit radius and small grit spacing cause less roughness damage.

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Section: Introductionmentioning

confidence: 99%

Roughness damage evolution due to wire saw process

Teomete

2011

Int. J. Precis. Eng. Manuf.

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“…The hydro-dynamic characteristics of the slurry have been studied [4], as well as its impact on the wire vibrations [5,6]. Furthermore, it is known that the size and concentration of the abrasive grains is of paramount importance to the quality of sawing [7,8].…”

Section: Introductionmentioning

confidence: 99%

Mechanisms of wafer sawing and impact on wafer properties

Bidiville

Wasmer

Michler

et al. 2010

Progress in Photovoltaics

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Silicon wafer wire-sawing experiments were realized with different sets of sawing parameters, and the thickness, roughness, and cracks depth of the wafers were measured. The results are discussed in relation to assumptions underlying the rolling-indenting model, which describes the process. It was also found that the silicon surface at the bottom of the sawing groove is different from the wafer surface, implying different sawing conditions in the two positions. Furthermore, the measured parameters were found to vary along the wire direction, between the entrance of the wire in the ingot and its exit. Based on these observations, some improvements for the wire-sawing model are discussed.

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“…This requires, however, a good understanding of the basic mechanisms. Great progress has been made here over the years (Bhagavat et al, 2000;Buijs & Korpel-van Houten, 1993c;Ferris & Chandrasekar, 1994;Funke et al, 2009;Li et al, 1998;Wei & Kao, 2000;Yang & Kao, 1999. The description of the loose abrasive process is based on the individual process of the interactions of a single particle with the crystal surface and the resulting microfracture processes.…”

Section: Basic Sawing Mechanismsmentioning

confidence: 98%

Wafering of Silicon

Möller

2015

Semiconductors and Semimetals

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Vibration Analysis of Wire and Frequency Response in the Modern Wiresaw Manufacturing Process

Cited by 59 publications

References 13 publications

Roughness damage evolution due to wire saw process

Roughness damage evolution due to wire saw process

Mechanisms of wafer sawing and impact on wafer properties

Wafering of Silicon

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