Via-walled cavities as vertical transitions in multilayer millimetre-wave circuits

Swierczynski, Tom; McNamara, D.A.; Clenet, Michel

doi:10.1049/el:20031190

Cited by 12 publications

(5 citation statements)

References 3 publications

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“…Vertical transitions can achieve the signal interconnection between multilayer structures. Usually, vertical transition can be achieved in 3 ways such as via‐connection vertical transitions, cavity‐coupled vertical transitions, , and aperture‐ or slot‐coupled vertical transitions , wherein the aperture‐ or slot‐coupled vertical transitions gain more attention because of easy fabrication and low cost. However, the reported microstrip vertical transitions are all single‐ended, and no balanced microstrip‐to‐microstrip vertical transition has been reported.…”

Section: Introductionmentioning

confidence: 99%

Wideband balanced microstrip-to-microstrip vertical transition

Shen

Shi

et al. 2018

Int J RF Microw Comput Aided Eng

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A wideband balanced microstrip‐to‐microstrip vertical transition is proposed. This vertical transition is based on the back‐to‐back hexagonal microstrip lines with a slot on the common ground. The etched slot is used to achieve the vertical transmission of differential‐mode signal and the suppression of common‐mode (CM) signal. The back‐to‐back hexagonal microstrip lines enable the transition to obtain wide bandwidth. One prototype shows the fractional bandwidth (|Sdd11| ≤ −15 dB) of 63%, the minimum (maximum) insertion loss of 0.7 dB (1.9 dB), and the minimum CM suppression inside passband of 27 dB.

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Section: Introductionmentioning

confidence: 99%

Wideband balanced microstrip-to-microstrip vertical transition

Shen

Shi

et al. 2018

Int J RF Microw Comput Aided Eng

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“…Aperturecoupled transition [6,7] can change the shape of an aperture or a microstrip terminal and obtain improved bandwidth, but it cannot be used as an appropriate design method. Finally, cavity-coupled transitions [8,9] have been presented to transfer signals through several layers with a relatively narrower bandwidth.…”

Section: Introductionmentioning

confidence: 99%

Compact Multilayer Hybrid Coupler Based on Size Reduction Methods

Kim¹,

Yoon²

2015

PIER Letters

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Abstract-This paper presents a compact multilayer hybrid coupler based on a microstrip viatransition and short transmission line with a capacitor on each side to reduce circuit size. The microstrip via-transition is connected to two microstrip lines in different layers to configure a sandwich structure. To reduce the passive component circuit size, the design method uses a microstrip via-transition and a short transmission line with capacitors on each side. To validate the microstrip via-transition and short transmission line with capacitor, a multilayer hybrid coupler is implemented at a center frequency of 2 GHz. The measured characteristics agreed well with the simulation results, and above 90% circuit-size reduction compared with conventional couplers was realized.

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“…Both the slot coupled structure and the via-probe transition structure can hardly perform well in millimetre wave band when fabricated with microstrip substrate for the affecting of parasitical inductive and capacitive. In [7], a SIW rectangular cavity was employed to couple energy from top layer to bottom layer without any auxiliary components in middle layers. The Via-walled cavity structure might perform well in higher frequency band for its high Q-value cavity and low parasitical inductive and capacitive structure.…”

Section: Introductionmentioning

confidence: 99%

“…The Via-walled cavity structure might perform well in higher frequency band for its high Q-value cavity and low parasitical inductive and capacitive structure. However, flexibility of the structure is not good enough, planar transmission lines in different layers of the transition in [7] can not spread out with arbitrary directions for the rectangular cavitys non-revolutioninvariant structure, which restrict the flexibility of application. In this paper, we present a novel transition which based on SICC (Substrate Integrated Circular Cavities) structure.…”

Section: Introductionmentioning

confidence: 99%