Vertical Transition in Multilayer Millimeter Wave Module Using Circular Cavity

Wu, Dakui; Yang, Fan; Zhao, Minghui; Zhang, and Yong-Hong

doi:10.2528/pierm08101305

Cited by 3 publications

(1 citation statement)

References 19 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The vertical transitions described in the literature can be categorised into two main groups: with-via and via-less. The first category is manufactured with technologies in which metalised vias are available [2][3][4][5]. However, in the MCM technology metalised vias in high resistive silicon are expensive and difficult to achieve.…”

mentioning

confidence: 99%

Vertical via-less transition in MCM technology for millimetre-wave applications

Enayati

Brebels

Deraedt³

et al. 2010

Electron. Lett.

View full text Add to dashboard Cite

A vertical multilayer transition for millimetre-wave frequencies is introduced and implemented in IMEC multi-chip module (MCM) technology. Simulation and measurement results for a back-to-back CPW-to-microstrip transition prototype show excellent agreement. Moreover, the microstrip-to-microstrip vertical via-less transition, as the core idea that is introduced, demonstrates less than 0.7 dB of loss in the band from 57 to 66 GHz, which satisfies the European as well as US standard bandwidth for 60 GHz communications systems. The low insertion loss along with the straightforward design procedure makes the proposed vertical via-less transition a valuable candidate for 60 GHz communications systems.Introduction: The millimetre-wave (MMW) frequency band has attracted much attention is recent years; not only because of the notable bandwidth available, but also the compactness capability in this band has been appealing to many researchers. To reach the demanding compactness factors in the MMW band, novel multilayer technologies have been developed for packaging and integration purposes. These technologies include multilayer printed circuit board (PCB) technology based on MMW-compatible laminates; low temperature co-fired ceramic (LTCC) and multi-chip module (MCM) thin film technology. In this Letter, IMEC's MCM technology [1] is used to fabricate a multilayer vertical transition useful in the measurement and packaging of active and passive devices in the MMW band. The term 'vertical' comes from the fact that in any of the aforementioned multilayer technologies, to reduce the area of the final product, the signals have to be brought from one layer to the other, vertically. The vertical transitions described in the literature can be categorised into two main groups: with-via and via-less. The first category is manufactured with technologies in which metalised vias are available [2][3][4][5]. However, in the MCM technology metalised vias in high resistive silicon are expensive and difficult to achieve. Therefore, via-less transitions are attractive from a practical point of view. Although there are via-less vertical transitions available in the literature [6,7], most of them have aperture-coupled geometries. In this Letter, a transition based on a broad-side coupler structure is introduced.

show abstract

mentioning

confidence: 99%

Vertical via-less transition in MCM technology for millimetre-wave applications

Enayati

Brebels

Deraedt³

et al. 2010

Electron. Lett.

View full text Add to dashboard Cite

show abstract

CPW-to-CPW via-connected vertical transition for millimeter wave applications

Enayati

Vandenbosch

Raedt

2010

2010 IEEE Antennas and Propagation Society International Symposium

View full text Add to dashboard Cite

Experimental Studies on Various Types of Animal Mimicking Robots

Kawamura

2010

2010 International Conference on Broadband, Wireless Computing, Communication and Applications

View full text Add to dashboard Cite

We have studied various types of animal mimicking robots, such as a fish robot, birds robot and an insect robot, since 2000. In the studies of the fish and the bird robots, optimization of the complex motions of swimming in the water and the flapping in the air were optimized in order to generate the maximum propulsion forces. In the studies of the robot of insect type, aerodynamic studies using a wind tunnel were performed. We also developed an advanced wind tunnel experimental method, by which small flapping robots of insect type can fly statically at a fixed point in the wind tunnel. It enables us to measure or observe various aerodynamic characteristics of the flapping micro air vehicles.

show abstract

Vertical Transition in Multilayer Millimeter Wave Module Using Circular Cavity

Cited by 3 publications

References 19 publications

Vertical via-less transition in MCM technology for millimetre-wave applications

Vertical via-less transition in MCM technology for millimetre-wave applications

CPW-to-CPW via-connected vertical transition for millimeter wave applications

Experimental Studies on Various Types of Animal Mimicking Robots

Contact Info

Product

Resources

About