A novel vertical transition through a multilayer printed circuit board is presented. The transition is designed to fulfill the cost and manufacturing constraints of next generation automotive radar sensors. This is achieved both by employing FR4 as material in the transition core and the fabrication in a standard high density interconnect process. The modified design of a quasi-coaxial structure solves the limitations determined by the constraints. Although FR4 has high dielectric losses, a vertical transition through multiple FR4 layers is realized with a low insertion loss of less than 2.1 dB within the automotive radar frequency range of 76 GHz to 81 GHz. A return loss better than 10 dB is achieved up to a frequency of 83.2 GHz. The reliability and repeatability of the transition is shown by measurements of several transitions from different production cycles.