2021 51st European Microwave Conference (EuMC) 2022
DOI: 10.23919/eumc50147.2022.9784202
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A Broadband Multilayer Vertical Transition at 79 GHz Employing FR4 as Core Material

Abstract: A novel vertical transition through a multilayer printed circuit board is presented. The transition is designed to fulfill the cost and manufacturing constraints of next generation automotive radar sensors. This is achieved both by employing FR4 as material in the transition core and the fabrication in a standard high density interconnect process. The modified design of a quasi-coaxial structure solves the limitations determined by the constraints. Although FR4 has high dielectric losses, a vertical transition… Show more

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Cited by 2 publications
(1 citation statement)
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“…Therefore, the top layer of the PCB is reserved exclusively for the antennas and no components are mounted on it. By using an low-loss vertical transition through FR4 [30], the PCB can be fabricated in a cost effective high-density interconnect process. The losses of 2 dB from the MMICs into the stripline are comparable to a conventional MMIC to microstrip line transition.…”
Section: B Pcb Technologymentioning
confidence: 99%
“…Therefore, the top layer of the PCB is reserved exclusively for the antennas and no components are mounted on it. By using an low-loss vertical transition through FR4 [30], the PCB can be fabricated in a cost effective high-density interconnect process. The losses of 2 dB from the MMICs into the stripline are comparable to a conventional MMIC to microstrip line transition.…”
Section: B Pcb Technologymentioning
confidence: 99%