2020
DOI: 10.1109/tvlsi.2019.2940649
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Vesti: Energy-Efficient In-Memory Computing Accelerator for Deep Neural Networks

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Cited by 40 publications
(14 citation statements)
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“…NDPproposals have explored many memory architectures. In the literature, SRAM-based NDP proposals mostly aim to insert logic capabilities to the host's cache memories or to the host's memory controllers [17,19,20,21,22,23,24,58,59,103,106]. This work modify the cache hierarchy trying to avoid moving data from the main memory and cache memories to the host's core.…”
Section: B Memory Architectures and Ndpmentioning
confidence: 99%
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“…NDPproposals have explored many memory architectures. In the literature, SRAM-based NDP proposals mostly aim to insert logic capabilities to the host's cache memories or to the host's memory controllers [17,19,20,21,22,23,24,58,59,103,106]. This work modify the cache hierarchy trying to avoid moving data from the main memory and cache memories to the host's core.…”
Section: B Memory Architectures and Ndpmentioning
confidence: 99%
“…Wang et al [20] extend Neural Cache by adding techniques to leverage sparsity-awareness, NN redundancy, and add new efficient compute algorithms for binary and ternary neural networks. Yin et al [21] part from the same base idea as Neural Cache, but enable more scalability by using XNOR-Accumulate operations to enable activation of multiple SRAM rows, double buffers to hide in-memory reprogramming latencies, and additional peripheral logic for multi-bit activation. Ramanathan et al [22] propose the BFree, a bit-line free LUTbased NDP in SRAM subarrays that allows reconfigurable precision and NN layout.…”
Section: Introductionmentioning
confidence: 99%
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“…A potential manner in which AI can be implemented in IoT devices is via a binarized CNN (BCNN) [3], where network parameters are expressed in a binary format with an inference accuracy comparable to that of the original CNN. Several researches have been conducted on implementing BCNN accelerators using various hardware platforms such as GPUs [4], ASICs [5][6][7][8][9][10][11][12][13][14][15][16], and FPGAs [17][18][19][20][21][22][23][24].…”
Section: Introductionmentioning
confidence: 99%
“…In M3D integration, there was a concern about the thermal problem induced by high power density and low heat dissipation capability. Thus, we evaluated the peak temperature of each BNN_Accel with HotSpot 6.0 [15]. For a conservative thermal evaluation, each BNN_Accel was placed beside the big CPU core cluster consuming 4.0 W, which was the thermal design power (TDP) of the cluster [16].…”
mentioning
confidence: 99%