2000
DOI: 10.1016/s0022-3093(99)00755-3
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Very high frequency hydrogen plasma treatment of growing surfaces: a study of the p-type amorphous to microcrystalline silicon transition

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Cited by 18 publications
(6 citation statements)
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“…We stress the fact that such a value is not, or just partly, due to a larger hydrogen concentration, as indicated by the dependence of E 04 on x regardless of H% [see Fig. In a previous paper 63 we reported, for half the power density used in this paper, an etching rate for a-Si: H of 0.05 nm/ s for 50 SCCM H 2 , and up to 0.2 nm/ s for 100 SCCM H 2 , which is a flow rate similar to that used for the 90-series. Rather, the absence of carbon in sp 2 configuration also contributes to high values for E 04 .…”
Section: Discussionmentioning
confidence: 91%
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“…We stress the fact that such a value is not, or just partly, due to a larger hydrogen concentration, as indicated by the dependence of E 04 on x regardless of H% [see Fig. In a previous paper 63 we reported, for half the power density used in this paper, an etching rate for a-Si: H of 0.05 nm/ s for 50 SCCM H 2 , and up to 0.2 nm/ s for 100 SCCM H 2 , which is a flow rate similar to that used for the 90-series. Rather, the absence of carbon in sp 2 configuration also contributes to high values for E 04 .…”
Section: Discussionmentioning
confidence: 91%
“…The observation is corroborated by the 0.2-0.4 eV larger E 04 obtained for the same x and lower hydrogen concentration, compared with rf deposited samples. 63 The larger SiC bond concentration, the almost total disappearing of methylated silicon groups in the latter case, and the overall structural differences described above can therefore be ascribed to the change in the plasma chemistry between the 48-and 90-sample series. In a previous paper 63 we reported, for half the power density used in this paper, an etching rate for a-Si: H of 0.05 nm/ s for 50 SCCM H 2 , and up to 0.2 nm/ s for 100 SCCM H 2 , which is a flow rate similar to that used for the 90-series.…”
Section: Discussionmentioning
confidence: 99%
“…Etching and posttreatment of silicon with hydrogen glow discharge plasma [1][2][3][4][5][6][7][8][9][10][11][12][13][14][15][16] or with atomic hydrogen produced by hot filament 4,17,18 have again received significant attention recently in the context of new, alternative gases and processes for patterning in microelectronic device fabrication, [1][2][3] posttreatment of thin-film silicon in order to enhance its crystallization, [11][12][13][14] cleaning and passivation of wafers prior to the deposition of epitaxial films, [19][20][21][22][23][24][25][26][27][28][29][30][31][32][33][34][35][36][37] and cleaning of devices for controlled nuclear research 38,39 and of equipment for plasma-induced deposition of thin films.…”
Section: Introductionmentioning
confidence: 99%
“…The Brüggeman effective medium approximation (BEMA) and a multilayer model ( Optical software [22]) were used to fit the R and T spectra measured ex situ in the UV-NIR range [23,24]. BEMA approximation is available in the multilayer model in order to implement intermixing of adjacent layers into the optical model [25].…”
Section: Methodsmentioning
confidence: 99%
“…UV-NIR spectrophotometric measurements were performed with an optic fiber AVANTES, model AvaSpec2048-USB2 (Eerbeek, Holland), able to obtain reflectance and transmittance (R and T) spectra in a wavelength range between 200 nm and 1100 nm. The Brüggeman effective medium approximation (BEMA) and a multilayer model ( Optical software [ 22 ]) were used to fit the R and T spectra measured ex situ in the UV-NIR range [ 23 , 24 ]. BEMA approximation is available in the multilayer model in order to implement intermixing of adjacent layers into the optical model [ 25 ].…”
Section: Methodsmentioning
confidence: 99%