2022
DOI: 10.1002/aelm.202200378
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Vertical Metal‐Oxide Electrochemical Memory for High‐Density Synaptic Array Based High‐Performance Neuromorphic Computing

Abstract: Cross‐point arrays of analog synaptic devices are expected to realize neuromorphic computing hardware for neural network computations with compelling speed boost and superior energy efficiency, as opposed to the conventional hardware based on the von Neumann architecture. To achieve desired characteristics of analog synaptic devices for fully parallel vector–matrix multiplication and vector–vector outer‐product updates, metal‐oxide based electrochemical random‐access memory (ECRAM) is proposed as a promising s… Show more

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Cited by 14 publications
(7 citation statements)
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“…Switching behavior at room temperature. The switching mechanism of the ECRAM device is articulated through three steps: 1) ion migration within the electrolyte, 2) ion diffusion into the channel, and 3) electrochemical reactions 32 . Upon application of a gate voltage, oxygen ions (or oxygen vacancies) migrate from the electrolyte toward the channel, accumulating at the interface before diffusing into the channel.…”
Section: Resultsmentioning
confidence: 99%
“…Switching behavior at room temperature. The switching mechanism of the ECRAM device is articulated through three steps: 1) ion migration within the electrolyte, 2) ion diffusion into the channel, and 3) electrochemical reactions 32 . Upon application of a gate voltage, oxygen ions (or oxygen vacancies) migrate from the electrolyte toward the channel, accumulating at the interface before diffusing into the channel.…”
Section: Resultsmentioning
confidence: 99%
“…About 50% of multi-level RS demonstrations based on hafnium oxide were implemented with pure hafnium oxide [30, 37, 38, 42, 44-47, 52, 54, 56, 57, 59, 71-81], another about 20% used hafnium oxide and aluminum oxide in various combinations such as bi-/multi-layers or aluminum hafnium oxide [31,33,47,48,64,[82][83][84][85], and the rest combined hafnium oxide with various other materials such as tantalum oxide [34,55,58,86,87], titanium oxide [35,40,51,88,89], tungsten oxide [53,63,90], molybdenum oxide [90], zirconium oxide [91], hafnium oxynitride [39], titanium oxynitride [32], or Pt nanoparticles [43], Ti [56,92], Ni [41], or Ba [36] interspersed in hafnium oxide or aluminum oxide.…”
Section: Methodsmentioning
confidence: 99%
“…8 c. Lee et al . successfully implemented vertical ECRAM cells with a minimum size (F) of four times the minimum feature size (4F 2 ) [ 67 ]. The manufacturing process involved sequential deposition of the WO 3 channel, HfO 2 electrolyte, and MoO y reservoir in a planar structure through sputtering.…”
Section: Device-level Analysismentioning
confidence: 99%